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Characteristics of halogen-free PCB board.Amplifier PCB Collection

source:Industry News release time:2021-11-22 Article author:sznbone Popular:pcb

  Characteristics of halogen-free PCB board.Amplifier PCB Collection(图1)

  Because the PCB surface uses P or N to replace the halogen atoms, the polarity of the molecular bond segment of the epoxy resin is reduced to a certain extent, thereby improving the insulation resistance and breakdown resistance of the PCB.

  1) The water-absorbent halogen-free board of the material. Because the lone pair of N and P in the nitrogen-phosphorus deoxygenating resin is less than that of the halogen, the probability of forming a hydrogen bond with the hydrogen atom in the water is lower than that of the halogen material, so the water absorption of the material is lower than that of the conventional halogen flame-retardant material . For the board, low water absorption has a certain impact on improving the reliability and stability of the material.

  2) The thermal stability of the material The content of nitrogen and phosphorus in the halogen-free sheet is higher than that of ordinary halogen-based materials, so the molecular weight and Tg value of the monomer are increased. When heated, its molecular mobility will be lower than that of conventional epoxy resins, so the coefficient of thermal expansion of halogen-free materials is relatively small. Compared with halogen-containing plates, halogen-free plates have more advantages, and it is also a general trend to replace halogen-containing plates with halogen-free plates. Laminating parameters may vary from company to company. The above-mentioned Yisheng substrate and polypropylene are used as multi-layer boards. In order to ensure the full flow of the resin and good bonding force, a lower heating rate (1.0-1.5/min) and multi-stage pressure matching are required. In addition, it takes a long time in the high temperature stage, and it is maintained at 180 for more than 50 minutes. The following is a set of recommended platen program settings and actual paper temperature rise. The bonding force between the copper foil and the base material of the extruded board is 1.ON/mm. After 6 times of thermal shock, the board has no delamination or bubbles.


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