Circuit board company|Inverter PCB factory|Multilayer PCB price-Shenzhen Weienchen Technology Co., Ltd.

Tel: +86-755-29662580

Email: sales@victoriapcb.com

current position: Home  》  News  》  Industry News

Shenzhen resin plug hole circuit board manufacturer

source:Industry News release time:2021-09-13 Article author:sznbone Popular:pcb

  Shenzhen resin plug hole circuit board manufacturer

  In recent years, the process flow of resin plugging has been widely used in the PCB circuit board industry, especially for products with high layers and high-precision PCB multi-layer circuit boards with large thickness. People hope to use resin plug holes to solve a series of problems that cannot be solved by using green oil plug holes or press-fit resin filling. However, due to the characteristics of the resin used in the circuit board process, many difficulties need to be overcome in the manufacture of the circuit board in order to obtain a good quality of resin plugged products. So do you know what the process of resin plugging is?

  12-layer blind buried via PCB circuit board/circuit board

  No resin plug hole process on the outer layer of the circuit board

  (1) The outer layer is made to meet the requirements of the negative film, and the through-hole thickness-to-diameter ratio is ≤6:1.

  The requirements for the negative film of the PCB circuit board are: the line width/line gap is large enough, the maximum PTH hole is less than the maximum sealing capacity of the dry film, and the circuit board thickness is less than the maximum board thickness required by the negative film. And there are no special requirements of the board, the special process board includes: partial electro-gold board, electroplated nickel gold board, half hole board, printed plug board, ringless PTH hole, board with PTH slot and so on.

  The production of the inner layer of the circuit board → pressing → browning → laser drilling → debrowning → outer layer drilling → copper immersion → whole board hole filling plating → slice analysis → outer layer pattern → outer layer acid etching → outer layer AOI →Follow-up normal process.

  (2) The outer layer is made to meet the requirements of the negative film, and the thickness-to-diameter ratio of the through hole is more than 6:1.

  Since the through-hole thickness-to-diameter ratio is greater than 6:1, the use of the entire board for filling and electroplating does not meet the requirements of the copper thickness of the through hole. After the entire board is filled and electroplated, it is necessary to use an ordinary plating line to conduct the through-hole copper Plating to the required thickness, the specific process is as follows:

  Inner layer production → pressing → browning → laser drilling → debrowning → outer layer drilling → copper sinking → whole board hole filling plating → full board plating → slice analysis → outer layer graphics → outer layer acid etching → follow-up Normal Process

  (3) The outer layer does not meet the requirements of the negative film, the line width/line gap ≥ a, and the thickness-to-diameter ratio of the outer layer through hole ≤ 6:1.

  The production of the inner layer of the circuit board → pressing → browning → laser drilling → debrowning → outer layer drilling → copper sinking → whole board hole filling plating → slice analysis → outer layer pattern → pattern plating → outer layer alkaline etching → Outer AOI → Follow-up normal process.

  (4) The outer layer does not meet the requirements of the negative film, and the line width/line gap

  Inner layer production → pressing → browning → laser drilling → debrowning → copper sinking → whole board hole filling electroplating → slice analysis → copper reduction → outer layer drilling → copper sinking (2) → full board electroplating → outer Layer pattern → pattern plating → outer alkaline etching → outer layer AOI → follow-up normal process.


Read recommendations:

Six-layer Immersion Gold Board (BGA)

Computer card board (four layers)

SMT stickers

Mobile phone board

High frequency PCB

Previous:Factors affecting the quality of exposure imaging by circuit board factories Back to list Next:PCB design multilayer circuit board lamination technology

Online message

Popular recommended products

Related Information

PCB hard material materials: BT, ABF, MIS

2021-12-03

What are the main materials for PCB flexible circuit board packaging substrates,AOI circuit board co

2021-12-02

The easiest way to install pogopin thimble,Amplifier PCB price

2021-11-30

Double-sided multilayer pcb circuit board jigsaw rules and skills,Video home phone PCB Vendor

2021-11-29

What are the disadvantages of OSP anti-oxidation circuit board technology,X-ray inspection PCB price

2021-11-29

Causes of PCB circuit board welding defects,X-ray inspection PCB company

2021-11-29

Causes of poor tin on circuit boards and preventive measures,Transformer T PCB sales

2021-11-26

The advantages of thick copper plate and the application field of circuit board,Transformer T PCB Wh

2021-11-26

Analysis of common failures of multilayer circuit boards,Transformer T PCB Processing

2021-11-26

Thick copper circuit board manufacturing process,AOI circuit board factory

2021-11-26

Circuit board cleaning and maintenance methods,AOI circuit board Merchant

2021-11-26

Is it really important to clean the circuit board (circuit board) PCBA?

2021-11-26

In which case the circuit board will be deformed,AOI circuit board Production

2021-11-26

How to ensure the normal operation of the circuit board at high temperatures,Analyzer PCB Wholesale

2021-11-26

Teach you the circuit board manufacturer to write the 8D report required by the customer,Analyzer PC

2021-11-26

Visual inspection of Beijing circuit board production line,AOI circuit board price

2021-11-26

What is the relationship between PCB multi-layer circuit boards and 5G,Analyzer PCB sales

2021-11-26

Beijing Circuit Board Factory: Multilayer Circuit Board,AOI circuit board Wholesale

2021-11-26

How to prevent the warpage of the circuit board,Amplifier PCB factory

2021-11-26

Analysis of common failures of circuit boards.,Amplifier PCB Merchant

2021-11-26

Take you to understand the electronic product multilayer circuit board,Analyzer PCB factory

2021-11-26

The reason and improvement method of open circuit on the circuit board,Analyzer PCB price

2021-11-26

Talking about the knowledge of PCB circuit board impedance,Analyzer PCB Processing

2021-11-26

What problems should be paid attention to in circuit board proofing,Amplifier PCB company

2021-11-26

Circuit board factory customer complaint handling process and matters needing attention.,Amplifier P

2021-11-26

The development trend of raw materials in the PCB circuit board industry,Amplifier PCB Collection

2021-11-26

Principle of inner layer processing of multi-layer automotive PCB soft and hard board

2021-11-24

Characteristics of halogen-free PCB board.Amplifier PCB Collection

2021-11-22

What to get rid of the halogen-free circuit board basis?Electrolytic capacitor PCB company

2021-11-20

The impact of pcb copper clad laminates on the upstream industry!Oscillator PCB factory

2021-11-19