source:Industry News release time:2021-12-28 Article author:sznbone Popular:pcb
In mixed-signal designs, manufacturers usually recommend separating analog ground from digital ground. Sensitive analog circuits are susceptible to high-speed switching and signals. Different analog and digital grounds separate the ground planes. However, it has the following shortcomings. It is necessary to pay attention to dividing the loop area of the ground wire and the crosstalk mainly caused by the discontinuity of the ground plane. The return current cannot pass directly along the signal trace, so we did not design in the loop area on the right, but there is a loop area.
Electromagnetic compatibility and electromagnetic interference (EMI)
For high frequency designs (such as RF systems), EMI can be a major disadvantage. The ground layer described earlier helps to reduce EMI, but depending on the 5G circuit board, the ground layer may cause different problems. Distance is important in laminates with more than 4 layers.
When the capacitance between the planes is small, the electric field expands in the substrate. At the same time, the impedance between the two planes is reduced, allowing the return current to flow into the signal plane. This will cause any high frequency signals passing through the plane to generate EMI.
A simple solution to avoid EMI is to prevent high-speed signals from passing through multiple layers. Add a decoupling capacitor and place a ground via around the signal trace.
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