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What are the disadvantages of OSP anti-oxidation circuit board technology,X-ray inspection PCB price

source:Industry News release time:2021-11-29 Article author:sznbone Popular:pcb

  What are the disadvantages of OSP anti-oxidation circuit board technology,X-ray inspection PCB price(图1)

  (1) High contact resistance affects electrical measurement;

  (2) Not suitable for wire welding;

  (3) Poor thermal stability, generally after a high temperature furnace, it will no longer have anti-oxidation protection;

  (4) Short process time, required for the first time Subsequent welding must be completed within 24 hours after welding;

  (5) Not resistant to corrosion;

  (6) The printing requirements are high and cannot be printed wrongly, because cleaning will destroy the OSP film;   (7) The tin penetration of wave soldering holes is poor.

  The four advantages of led circuit board equipment:

  1. Meet the PoHs requirements for lead (Pb), copper (Cd), mercury (Hg), six prices (Cr6+), polybrominated biphenyls (PBBs) and polybrominated diphenyl ethers (PBDEs), all in line with international standards Standard;

  2. More suitable for SMT process;

  3. Low cost, small size and easy to assemble. Reduce the assembly of heat sink and other hardware (including thermal interface materials), reduce product volume, reduce hardware and assembly costs; combine power circuits;


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