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What is included in the 5G RF front end of the mobile phone wireless charging soft board? (Part 2)

source:Industry News release time:2021-12-21 Article author:sznbone Popular:pcb

  What is included in the 5G RF front end of the mobile phone wireless charging soft board? (Part 2)(图1)

  Front-end modularization becomes more and more complex

  In the 5G era, the degree of modularization of RF front-ends will become higher and higher. With the upgrade of communication standards, more frequency bands and higher-level communication systems must have downward compatibility. Therefore, more and more radio frequency devices become more and more complex. At the same time, battery capacity and mobile phone wireless charging soft board factories Compress the PCB board surface products determine the inevitable trend of modularization:

  1. The terminal is miniaturized. The modularity of the RF front-end reduces the PCB footprint, which is particularly important for mobile phones with an inch of land.

  2. Consistency of mass production. When using a single part to construct a complex radio frequency circuit, it is difficult to ensure consistency during mass production. Modularization makes the circuit internal and has higher reliability.

  3. Shorten the development cycle. The modularization of the RF front-end improves the R&D efficiency of mobile phone manufacturers, shortens the product development cycle, and enables mobile phone manufacturers to bring new products to the market faster.

  RF front-end modules mainly have three architectures: PAMiD architecture, MMMBPA+ASM architecture, MMPA+TxFEM architecture, generally corresponding to various forms of modularization. MMMB PA integrates 2G/3G/4G PA and is connected to the antenna switch module ASM through an external filter and duplexer, that is, MMMB PA+ASM architecture. MMPA+TxFEM is currently the most widely used RF front-end architecture in China. MMPA only integrates 3G/4G PA, and 2G PA integrates ASM, which is called "TxFEM". PAMiD integrates MMMB PA+ FEMiD to provide the highest level of integration. The mainstream flagship models should support most of the world's frequency bands, and most of them use the PAMiD architecture.

  


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