source:Industry News release time:2022-09-23 Article author:yu Popular:pcb
Everyone knows that there are some design hidden dangers when PCB board manufacturers design circuit board PCB proofing. question:
1. The pads on the pcb circuit board overlap
The overlapping of the pads of the pcb circuit board refers to the overlapping of the board holes. During the drilling process, the hole will be damaged due to multiple drilling in one place, resulting in scrapping;
2. Graphics layer abuse
The specific performance is as follows: some useless connections are made on some graphic layers, originally a four-layer board, but circuits with more than five layers are designed, which leads to misunderstanding; it violates the conventional design, such as the component surface is designed on the Bottom layer, and the welding surface is designed on the bottom layer. Top, causing inconvenience, thus maintaining the integrity and clarity of the graphic layer when designing;
3. The characters are randomly placed
This situation is embodied as: the characters cover the SMD solder pads of the pcb circuit board, which brings inconvenience to the on-off test of the pcb circuit board and the welding of components; and the character design is too small, which will cause difficulties in silk-screening the pcb board; too much Assembly causes characters to overlap each other, making it difficult to distinguish clearly;
4. The problem of setting the pad aperture of single-sided pcb circuit board
The pads of single-sided pcb circuit boards are generally not drilled. If the drill hole needs to be marked, the hole diameter should be designed to be zero. If the numerical value is designed, when the drilling data is generated, the coordinates of the hole appear in this position, and the problem occurs;
5. Draw pcb circuit board pads with padding blocks
It can be detected by DRC when designing pcb circuits, but it is not suitable for PCBA processing. When applying solder resist on the pcb board, the fill block area will be completely covered by the solder resist, making the device difficult to solder;
6. There are too many filling blocks in the design of the pcb circuit board or the filling blocks are filled with extremely thin lines.
Too many filling blocks can easily lead to: loss of light drawing data, incomplete light drawing data or a considerable amount of light drawing data, which increases the difficulty of data processing;
7. The pad design of the pcb circuit board is too short
This is the case for switch testing. For surface mount devices with too dense pads on the pcb circuit board, the distance between the two feet is quite small, and the pads on the pcb circuit board are also quite thin. When installing the test pin, it must be staggered up and down (left and right). If the design of the pcb pad is too short, although it will not affect the device installation, it will make the test pin position wrong;
8. Large area grid spacing is too small
The large-area grid spacing is too small (less than 0.3mm), in the manufacturing process of the pcb circuit board, a large amount of broken film is easily produced on the pcb board during the image transfer process, and after the development is completed, it will lead to disconnection;
9. The large area copper foil of the pcb circuit board is too close to the outer frame
The large-area copper foil of the pcb board should be at least 0.2mm away from the outer frame, otherwise it will easily cause the copper foil to warp and the resulting solder mask to fall off;
10. The special-shaped hole of the pcb circuit board is too short
The length/width of the special-shaped hole of the pcb board should be ≥2:1, and the width should be <1.0mm; otherwise, the drilling machine is easy to break the drill when processing the special-shaped hole of the pcb board, which makes the PCBA processing difficult and the cost also increases.
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