source:Industry News release time:2021-04-27 Article author:Victoria Popular:pcb
1. Problem background
Recently, among the batch of products sent to foreign customers by Weienchen Electronics, a certain percentage of the products cannot be turned on in the feedback of the terminal market. It was found that the BGA on the motherboard fell off after the pcba patch. Most of the PCB solder joints are disconnected from the IMC layer on the solder ball side, and their fractures show brittle fracture characteristics, and a small number of solder joints are disconnected from the PCB substrate. We have reported related problems to customers in the early circuit board proofing.
Analyzing that BGA completely falls off from the PCB substrate is a relatively rare failure mode, which is generally caused by a drop in elevation during transportation.
The complete fall of the BGA usually occurs in such a scenario: a heavier radiator is attached to the BGA, and the IMC is thicker. From the perspective of the peeling phenomenon, a small part of the solder joints are disconnected from the PCB substrate. This is a typical over-stress or impact stress fracture feature, indicating that the board has over-stress operations (such as transportation drops). The brittle fracture of large-scale solder joints in the production of integrated circuit boards is either due to the super thick MC or the existence of gold brittleness. Therefore, the focus of the analysis is on the IMC form and composition of the failed BGA.
2. BGA slice analysis after welding
The surface treatment of this BGA carrier board is ENIG, and the production conditions are used for reflow soldering, and the solder balls are sliced and analyzed. The slice image is shown in Figure 7-68. It can be observed that the MC on the BGA side is massive and super thick, which meets the conditions for causing BGA to fall off.
In addition, it is possible that there are too many ternary alloys in the IMC composition.
Among them, in the process of reflow soldering, an inappropriate temperature curve may be adopted to cause the production of ultra-thick IMC, which becomes the main factor that causes the BGA to fall off completely.
After a joint search with the customer engineer, the final solution is:
1. Reinforce the BGA with glue to improve the anti-drop ability during transportation and use.
2. Adjust the temperature curve and control the welding time.
When customers process PCBA patches in large quantities, this problem never reappears. In many cases, we don't worry about the problem, but everyone's attitude to solve it.
Read recommendations:
Six-layer Immersion Gold Board (BGA)
Six-layer Immersion Gold Board (BGA)
Popular recommended products
Six-layer Immersion Gold Board (BGA)
2021-04-27Six-layer Immersion Gold Board (BGA)
2021-05-27Single copper base PCB
2021-04-27Six-layer Immersion Gold Board (BGA)
2021-04-27Six-layer Immersion Gold Board (BGA)
2021-04-27Computer card board (four layers)
2021-04-25Network communication board (sixth floor)
2021-04-29Aluminum substrate (double-sided)
2021-04-27Six-layer Immersion Gold Board (BGA)
2021-05-24High frequency PCB
2021-04-27Mobile phone template (six layers)
2021-04-27Six-layer Immersion Gold Board (BGA)
2021-05-27High frequency PCB
2021-04-27Six-layer Immersion Gold Board (BGA)
2021-05-24Silver oil perforated plate (double-sided)
2021-04-27High frequency PCB
2021-04-27Six-layer Immersion Gold Board (BGA)
2021-05-27Six-layer Immersion Gold Board (BGA)
2021-04-27High frequency PCB
2021-04-27Single-sided double-layer AL base PCB
2021-04-27Six-layer Immersion Gold Board (BGA)
2021-05-27Display board (six layers)
2021-04-27Laminate copper-based PCB after 4L (sample)
2021-04-27SMT stickers
2021-05-27SMT stickers
2021-05-27Mobile phone board
2021-04-27Six-layer Immersion Gold Board (BGA)
2021-04-26Six-layer Immersion Gold Board (BGA)
2021-04-26Six-layer Immersion Gold Board (BGA)
2021-04-26Six-layer Immersion Gold Board (BGA)
2021-04-26Six-layer Immersion Gold Board (BGA)
2021-04-26DIP plugin
2021-05-27Mobile phone board
2021-05-27DIP plugin
2021-05-27Related Information
The relationship between PCB safety distance and voltage
2024-04-22SMT surface mount processing.Hybrid circuit board PCB
2024-04-15PCB enterprises should pay attention to SMT matters.Electronic components PCB
2024-04-03PCB - the core building block of electronic products.Automotive Electronics PCB
2024-03-25PCB - the bridge and link of the electronic world
2024-03-18How to define high-frequency and high-precision circuit boards.Industrial Electronics PCB
2024-03-11USB PCB interface layout and wiring requirements
2024-01-22Electrolytic capacitor PCB.Steps for using PCB pins
2024-01-15Automotive ElectronicWhat aspects should be considered when processing and manufacturing PCB boards?
2024-01-08Electrolytic capaciWhat is the difference between a gold-plated circuit board and a gold-plated one?
2023-12-25When grinding PCB boards, attention should be paid to.Oscillator (belonging to crystal) PCB
2023-12-18Industrial Electronics PCB!What precautions should be taken when copying and grinding PCB boards
2023-12-11Do you know who is more suitable for LED direct display, regarding the difference between PCB board
2023-12-05Aluminum electrolytic capacitor PCB.What are the standards for selecting PCB boards
2023-11-27Surface Mount Technology (SMT) Phase PCB
2023-11-20Oscillator (belonging to crystal) PCB.The main functions of PCB board
2023-11-13What is the difference between RO filter and PCB filter
2023-11-06Method for determining blind hole PCB board
2023-11-01Electronic Manufacturing Services PCB!What are the effects of PCB board color on performance?
2023-10-23Introduction to the Manufacturing Steps and Requirements of PCBA Test Stand
2023-10-16PCB version maturity stage.AOI circuit board price
2023-09-25How to maintain a PCB circuit board
2023-09-19Development Trend of Printed Circuit Board.Zener diode PCB Vendor
2023-09-14Common problems and cause analysis of PCB circuit board sampling.Zener diode PCB price
2023-09-08What are the issues that need to be understood in PCB circuit board design?IGBT module PCB factory
2023-09-08How to reduce the risk of bending and deformation in PCB circuit board production?Inverter PCB Produ
2023-08-16What are the three main factors that constitute welding defects in PCB circuit boards?Multilayer PCB
2023-08-16The structure of a glass teapot.LCD Module PCB factory
2023-08-11Glass teapot.Inverter PCB Processing
2023-08-11PCB online debugging
2023-08-08
CopyRight © 2007-2024Shenzhen Weienchen Technology Co., Ltd.
粤ICP备2021061255号
Address:
1205, Floor 12, Building 3, Chuangyi Office Building, No. 110, Ziheng West Road, Jinsha Community, Kengzi Street, Pingshan District, Shenzhen, Guangdong, China
Tel:
+86-755-29662580
Email:
sales@victoriapcb.com
PCB
PCBA
Service
Process
Tel: +86-755-29662580
Email: sales@victoriapcb.com
中
current position:
