source:Industry News release time:2023-12-05 Article author:yu Popular:pcb
For a long time, glass substrates and PCB boards have maintained a "clearly different" situation, and have played their advantages in different occasions. Among them, glass substrates are mainly used by LCD panel companies and are usually used in panel processes. PCB boards are used for all integrated circuit electronic devices. On the contrary, compared to glass substrates, the application range of PCB boards is becoming wider and wider. However, with the advancement of display technology, this balance is gradually being disrupted, and glass substrates and PCB boards have shown a trend of mutual penetration, especially in new display technology fields such as Mini/Micro LEDs. The company is facing the issue of choosing a glass substrate or a PCB board as the carrier. Dai Zhiming, Chairman of Lanpu Video, once stated that the key to mass transfer technology is to choose to use glass substrates to transfer chips or PCB boards.
In the past two years, Mini LED backlight technology has become increasingly popular, attracting many companies to deploy, and even some manufacturers have explicitly stated that they will achieve mass production of Mini LED backlight products this year. In a report released in April this year, Chuancai Securities pointed out that 2020 was the first year of mass production of "Mini LED backlight+LCD" products, and the application of Mini LED technology is now economical.
LED glass is widely used in various design and application fields, such as indoor and outdoor decoration, decoration, and decoration of commercial or furniture; Furniture design; Lighting design for lighting fixtures; Interior landscape design; Indoor shower partition; Clinic; Design of emergency signs for house numbers; Meeting room partitions; Outdoor curtain wall glass, display windows, counter design, gorgeous counter design, skylight design, ceiling design, sunroom design, 3C product glass panel application, indoor and outdoor billboard design, fashionable home accessories, clocks, prizes, lighting and other terminal application product design in a wide range of fields.
From a performance perspective, glass substrates have high thermal conductivity and can better dissipate heat. It can also meet the more complex wiring requirements on higher density welding products; In addition, the flatness of glass substrates is higher, making it easier to achieve breakthroughs in chip transfer technology, which is also the most prominent advantage of glass substrates in the application process. Compared with glass substrates, due to material limitations, PCB boards have poor heat dissipation and are prone to warping and deformation in large-scale applications. Therefore, in terms of performance, glass substrates have more advantages than PCB boards.
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