source:Industry News release time:2022-04-08 Article author:sznbone Popular:pcb
Many friends in circuit board factories often ask: how can BGA be designed to strengthen and improve its strength to prevent BGA cracking? Because some customers complain that the circuit board has BGA cracking problems, the company must have someone responsible for this.
In fact, isn't it the senior executives who should be most responsible? Not only are the product designs required to be light and thin, but they are also required to catch up with the schedule, shortening the original 12-month new product cycle to nine months, and now it has been compressed to six months , and the ID has been changing all the time, the schedule cannot be delayed, and the product design must be perfect, this group of engineers can only sacrifice their lives, sell their livers, and everyone is in danger. How has this company culture changed? like this?
Before we start discussing this topic, we must first understand why the BGA cracks? Let's put aside the manufacturing problem first, assuming that all the BGA solder balls are well soldered and the IMC is well generated, but the BGA cracks still occur. The main reason should be Stress, the reason for this conclusion is that almost all products that have been analyzed have an absolute relationship with stress.
Circuit board (circuit board)
The sources of stress for circuit board parts falling or tin cracks are as follows:
1. Stress comes from external impact or pressure
Taking a mobile phone as an example, the most likely external stress is the force bending in the pocket (the iPhone 6plus bending door incident), or the impact caused by accidentally falling to the ground.
2. Stress comes from internal creep
For example, when the circuit board or BGA package is deformed by reflow at high temperature, the stress will be released until it reaches a balance point before it stops. This balance point may also be when the solder balls crack.
3. Stress comes from thermal expansion and contraction caused by changes in ambient temperature
In some areas, the outdoor freezes in winter, and when the product moves from the indoor heated environment to the outdoor, a drastic temperature change occurs; in tropical areas, there is air conditioning indoors, and the temperature changes greatly from indoor to outdoor. Not to mention accidentally or deliberately placing the product in the car, the temperature rises during the day, and the temperature drops rapidly at night. The reason why temperature is important is that different materials have different expansion coefficients. The expansion coefficient of the circuit board is definitely different from that of solder balls, and it is also different from the material of BGA packages. Seams” to reduce the risk of thermal expansion and contraction of materials, but electronic materials seem to have to try to find materials with a relatively small expansion coefficient.
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