source:Industry News release time:2022-06-16 Article author:yu Popular:pcb
In order to ensure the production quality of HDI circuit boards, manufacturers have gone through a variety of testing methods during the production process, and each testing method will target different HDI circuit board defects.
1. Solderability test of HDI circuit board
The solderability test of HDI circuit boards focuses on the test of pads and plated through holes. The solderability test methods of HDI circuit boards are specified in standards such as IPC-S-804, which include edge dip test, rotary dip test, wave crest Dip Test and Solder Bead Test etc.
2. Internal defect detection of HDI circuit boards
Micro-sectioning technology is generally used to detect the internal defects of HDI circuit boards, and the specific detection methods are clearly stipulated in relevant standards such as IPC-TM-650. The main inspection items for microsection inspection are the thickness of copper and tin-lead alloy coatings, the alignment between conductor layers inside the PCB multilayer circuit board, lamination voids and copper cracks.
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