source:Industry News release time:2022-09-20 Article author:yu Popular:pcb
At present, in the field of electronic product processing, multilayer circuit boards are indispensable as one of the important electronic components. At present, there are many types of PCB circuit boards, such as high-frequency circuit boards, microwave circuit boards and other types of printed circuit boards have gained a certain reputation in the market. Multilayer circuit board factories have specific processing and production processes for various types of boards. But in general, multilayer circuit board manufacturers need to consider three aspects.
1. Consider the selection of process flow
The production of multi-layer circuit boards is easily affected by various factors. The number of processing layers, the drilling process, the surface coating treatment and other processes will affect the quality of the finished PCB circuit board. Therefore, for these process flow environments, the production of multi-layer circuit boards is fully considered in combination with the characteristics of the production equipment, and can be flexibly adjusted according to different types of PCB boards and processing requirements.
2. Consider the choice of substrate
The substrates of circuit boards can be mainly divided into two categories: organic materials and inorganic materials, each of which has its own unique advantages. Therefore, the determination of the type of substrate considers various properties such as dielectric properties, copper foil type, base groove thickness, and processability. Among them, the thickness of the surface copper foil is a key factor affecting the performance of this printed circuit board. Generally speaking, the thinner the thickness, the advantages for the convenience of etching and the improvement of the precision of the pattern.
3. Consider the settings of the production environment
The environment of the multi-layer circuit board production workshop is also a very important aspect, and the regulation of ambient temperature and ambient humidity is a crucial factor. Excessive changes in ambient temperature can cause the drilled holes in the substrate to break. If the environmental humidity is too high, the nuclear energy will have an adverse effect on the performance of the substrate with strong water absorption, which is specifically reflected in the dielectric properties. Therefore, it is necessary for circuit board manufacturers to maintain proper environmental conditions during production.
In summary from the above description, the selection of substrates, the setting of production environment, and the selection of process flow need to be considered when manufacturing circuit boards. At the same time, the processing and blanking method of the engineering materials of the PCB circuit board is also an aspect that needs to be carefully selected, which is closely related to the layout smoothness of the finished circuit printed circuit board.
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