source:Industry News release time:2022-04-25 Article author:yu Popular:pcb
In the production process of PCB circuit board manufacturers, there is a process called "exposure". Generally, CCD semi-automatic exposure machines are used in PCB factories, while Honglian Circuit Shenzhen Honglian Circuits has introduced LDI direct imaging exposure machines in addition to CCDs. Compared with the traditional CCD semi-automatic exposure machine, LDI has many advantages, such as: no need for direct imaging of film, which reduces the cost of film production, shortens the sample delivery time, reduces the error of film production and alignment, and improves line exposure. In addition to the above advantages, the exposure speed of LDI is slower than that of CCD, which makes it more suitable for sample preparation. The following PCB manufacturers will analyze the reasons for the slow exposure speed of the LDI machine for you.
The bottleneck factors of LDI exposure speed include: data storage and transmission, laser energy, switching speed, polygon production speed, photoresist sensitivity, laser head moving speed, circuit board transfer operation mode, etc.
Among PCB circuit board manufacturers, in terms of basic influencing factors, there are three independent factors that will affect the exposure rate:
1. Energy density 2. Speed of data modulation 3. Speed of mechanical mechanism
Photoresist must have a certain amount of energy delivered to the surface to produce proper exposure, and high-sensitivity photoresist requires relatively low energy. Because the total energy is equal to the power multiplied by the time, the exposure time required for the high-sensitivity photosensitive film under the same power is shorter. The functional output of the exposure system mainly comes from the light source design of the system, so the relationship between energy and time has nothing to do with resolution.
In other words, the modulation switching speed of the laser determines the number of light spots that can be drawn per second, and the resolution requirement will of course affect the production speed. When the resolution is doubled, the number of light spots to be produced is quadrupled, so the resolution and the modulation load of the similar exposure equipment will have a geometric magnification relationship.
The speed of the platform movement will be the third factor, especially the mechanism of acceleration and deceleration. When the circuit board has to move to a new scanning area, the time required for its movement will directly affect the speed of production. This concept is related to the laser The drilling machine concept is similar.
Although the LDI exposure machine is slow, it is inseparable from the production of high-precision circuits. At the same time, it can also shorten the time for making films and reduce the cost of making films for PCB samples. Many customers will ask, why do not use LDI exposure in batches? The above LDI speed analysis answers this question.
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