source:Industry News release time:2021-09-13 Article author:sznbone Popular:pcb
The process of using resin plug holes in circuit boards is often due to BGA parts, because traditional BGA may make VIA between PAD and PAD to the back of the wiring, but if the BGA is too dense and the VIA cannot go out, you can drill directly from the PAD The hole is made via via to another layer to route, and then the hole is filled with resin and copper-plated into PAD, which is commonly known as the VIP process (viainpad). If you only make via on the PAD without plugging the hole with resin, it is easy to cause The leakage of tin leads to short-circuit on the back and empty solder on the front.
The process of resin plug holes for circuit boards includes drilling, electroplating, plugging, baking, and grinding. After drilling, the holes are plated through, then the resin is plugged and baked, and finally the resin is polished and smoothed. It does not contain copper, so another layer of copper is needed to turn it into a PAD. These processes are done before the original PCB circuit board drilling process, that is, the holes of the fortress hole are processed first, and then other holes are drilled. , Follow the original normal manufacturing process.
If the plug hole of the circuit board is not properly plugged, and there are bubbles in the hole, because the bubbles are easy to absorb moisture, the PCB circuit board of the circuit board may burst when it passes through the tin furnace. However, if there are bubbles in the hole during the plugging process, dry it. Air bubbles will squeeze out the resin during baking, resulting in a situation where one side is recessed and the other is protruding. At this time, defective products can be detected, and the circuit board with air bubbles does not necessarily explode, because the main cause of the explosion is moisture, so If the board or board that has just been shipped from the factory has been baked during loading, generally speaking, it will not cause the board to burst.
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