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Project	Batch processing capacity	Sample processing capability
Huo Fu (maximum)	2-22 FR-4, high TG sheet, aluminum base sheet	24-28 PTFE, PPO, PPE
Sheet type	Rogers, etc PTFE, BT	E-65 ct ect
Board mixed seat	4 floors-6 floors	8 layers (FR-4+ogers)
biggest size	400mm X 700mm	500mm X 1000mm??
Overall dimension tolerance	±0.13mm	±0.10mm
V-CUT depth tolerance	+/- 0.15 mm (V-CUT) ：+/- 0.1 mm (CNC V-CUT)
Thickness of the board	0.1mm--6.00mm	6.0mm--8.00mm
Board thickness tolerance (t20.8mm)	±8%	±5%
Board thickness tolerance (t<0.8mm)	±10%	±8%
Intermediate thickness (minimum)	0.065(RCC65T)	0.05mm
Smallest gland	0.075mm（3mil）	0.063mm(2.5mil)
Minimum green distance	0.075mm（3mil）	0.063mm(2.5mil)
Gland to slander distance	0.2 mm（CNC）：0.30 mm (Beer board)：0.50 mm (V-CUT)
Outer Cuo Copper Thickness	9um - 140um	175um--210um
Inner Cuo Copper Thickness	9um - 140um	175um--210um
Aperture of hole	0.25mm--6.00mm	0.15mm--0.25mm
Hole diameter (building machinery 2)	0.1mm--6.00mm	0.05mm--0.1mm
Aperture tolerance (floor machinery two)	+/- 0.076 mm (regular hole): +/- 0.05 mm (NPTH t and crimp hole): +0.1/-0.05 mm (piper hole)
Hole position tolerance (mold machine o)	+/-0.075mm: (drilling): +/- 0.10 mm (punching)	0.050mm
Laser o hole hole capture	0.10mm	0.075mm
Plate thickness aperture ratio	10:1 (minimum drilling hole diameter is greater than 0.2MM)	12:1 (minimum drilling hole diameter is greater than 0.25MM)
Solder mask down type	Photosensitive green, yellow, black, matte green, blue, red ink, and peelable blue glue.
The smallest solder mask	0.10mm	0.075mm (partial)
Minimum solder mask male isolation ring	0.05mm	0.025mm (partial)
Plug hole diameter	0.25mm--0.60mm	0.60mm-0.70mm
Impedance tolerance	±10% (impedance>50ohm);±5ohm(impedance<50ohm)	±5%? (impedance>50ohm)
Superficial	Hot air leveling, electroplating of nickel gold (soft gold), thick (hard) gold, electroless nickel gold, immersion tin, lead-free tin spray, gold finger, Entek, and selective surface treatment

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