The packaging substrate is the largest cost of IC packaging, accounting for more than 30%. IC packaging costs include pac
Today's electronic and electrical products are developing in the direction of precision, easy installation and long l
(1) High contact resistance affects electrical measurement; (2) Not suitable for wire welding; (3) Poor thermal stabili
Reasonable design of multi-layer pcb circuit board assembly not only involves the quality of the circuit board, but also di
1. Poor warpage welding During the soldering process, circuit boards and components warp, causing defects such as virtua
The circuit board will not be well tinned during SMT production. Generally, poor tinning is related to the cleanliness of