source:Industry News release time:2021-11-29 Article author:sznbone Popular:pcb
1. Poor warpage welding
During the soldering process, circuit boards and components warp, causing defects such as virtual soldering and short circuits due to stress. Warpage is usually caused by the temperature imbalance between the top and bottom of the circuit board. For large PCBs, warping will also occur due to the reduction in the weight of the board itself.
The typical PBGA device is about 0.5mm away from the printed circuit board. If the device on the circuit board is large, the circuit board will cool down and stress will be applied to the solder joints for a long time.
2. The design of the circuit board affects the welding quality.
If the size of the circuit board in the layout is too large, the soldering is easier to control, but the printed line is long, the impedance increases, the noise protection is reduced, and the cost increases. Interfering with circuit boards, such as electromagnetic waves. Therefore, the PCB board design should be optimized as follows:
Shorten the connection between high-frequency components and reduce EMI interference.
Heavy parts (for example, more than 20 grams) must be fixed with brackets and then welded.
In order to avoid defects and rework caused by the excessive surface of the heating element, the heat dissipation of the heating element should be considered, and the heating element should be kept away from the heat source.
The arrangement of the parts is as parallel as possible, which is not only beautiful but also easy to weld, suitable for mass production. The design of the circuit board is the best rectangle. Do not change the wiring width to avoid discontinuous wiring.
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