source:Industry News release time:2022-07-12 Article author:yu Popular:pcb
After the circuit board is patched, many users will encounter the situation that the vias are blocked. In those cases, the vias will be blocked. According to personal past experience, I will share the reasons why the vias are blocked after the patch. Of course, this reason is due to the production of circuit board manufacturers on the one hand, and the reason of SMT on the other hand. Analyze both aspects.
1. Defects caused by the drilling of the circuit board
The board produced by the circuit board is made of epoxy resin glass fiber. Referred to as FR4 fiberglass board. After the circuit board is drilled, there will be a layer of dust in the hole. Especially drill holes above 0.3MM. If the dust is not cleaned, copper cannot be deposited in the dusty place after curing, which will cause the via hole to be blocked. The defects caused by drilling can be tested if the PCB has been tested. This kind of bad circuit board manufacturers can do scrap processing.
2. Defects caused by copper sinking
The first choice is that the time for sinking copper is too short. The hole copper is not full. When the tin is applied, the hole copper melts off and causes defects. Most of these appear in vias below 0.3MM. The second is that the circuit board needs too much current without thickening the copper. After the power is turned on, the current is too large to melt the copper in the hole, which will cause defects. Therefore, if there is a PCB board that requires excessive current, it must be told to the circuit board manufacturer to thicken the copper during production. For example, circuit boards such as power supply boards are almost always made of thick copper plates.
3. Defects caused by SMT tin or flux quality and technology
This type of situation mostly occurs in the vias of the plug-in. The tin used by SMT manufacturers is not pure, and there are too many impurities. And the quality of the flux is too poor. Tin and tin welding is not good. This is easy to cause virtual welding. Components do not work. In addition, there are technical problems in SMT, which makes the circuit board stop flowing for too long when it passes through the tin furnace during soldering. Cause the hole copper to melt. The resulting vias are blocked
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