source:Industry News release time:2023-11-20 Article author:yu Popular:pcb
1. Function of conducting hole: It only serves as an electrical interconnection, and the aperture can be as small as possible, even if the hole is plugged.
2. Main ways to increase density
① The size of the through-hole decreases sharply: 0.8mm -0.5mm -0.4mm -0.3mm -0.25mm
② The structure of the via undergoes essential changes:
a. Advantages of buried blind hole structure: increase wiring density by more than 1/3, reduce PCB size or layers, improve reliability, improve characteristic impedance control, and reduce crosstalk, noise, or distortion (due to short lines and small holes)
b. Hole in pad eliminates relay holes and connections
③ Thinning: Double sided board: 1.6mm -1.0mm -0.8mm -0.5mm
④ PCB flatness:
a. Concept: The warpage of the PCB board substrate and the coplanarity of the connecting plate surface on the PCB board surface.
b. PCB warpage is a comprehensive result of residual stress caused by thermal and mechanical factors
c. Surface coating of the connecting disc: HASL, chemical plating NI/AU, electroplating NI/AU
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