source:Industry News release time:2022-06-20 Article author:yu Popular:pcb
Critical components require pre-checkpoints on the PCB. The pads used for soldering surface mount components are not allowed to double as inspection points, and other preset dedicated inspection pads are necessary to ensure that solder joint inspection and production debugging can be carried out without problems. The pads used for inspection are arranged on one side of the PCB as much as possible, even for inspection, which is beneficial to reduce the cost of inspection.
1. Process preset requirements
(1) The distance between the inspection point and the edge of the PCB should be greater than 5mm;
(2) The inspection point cannot be covered by solder mask or text ink;
(3) The size, distance and layout of the inspection point pads should also match the relevant requirements of the inspection equipment used;
(4) The inspection point should be placed 1mm away from the element to prevent the probe and element from colliding;
(5) The best solder plating at the inspection point or the use of softer, easy-to-penetrate, and non-oxidative metals to ensure that they are grounded and extend the service life of the probe;
(6) The diameter of the inspection point is not less than 0.4mm, and the distance between adjacent inspection points is more than 2.54mm, but not less than 1.27mm;
(7) Components with a height of more than 6.4mm cannot be placed on the inspection surface. Too high components will cause poor contact between the probes of the online inspection fixture and the inspection points;
⑻ The distance C from the center of the inspection point to the end edge of the chip component is related to the SMD height H as follows: SMD height H≤3mm, C≥2mm; SMD height H≥3mm, C≥4mm.
(9) The inspection point should be placed in the positioning hole (cooperative inspection point is used for precise positioning, preferably non-metallized hole, the error of the positioning hole should be within ±0.05mm) 3.2mm around the ring;
2. Electrical Preset Requirements
(1) The inspection points should be evenly distributed on the PCB circuit board to reduce the compressive stress of the probe;
(2) When setting the check point on the circuit trace, its width can be expanded to 1mm;
(3) Each electrical contact needs to have a check point, and each IC needs to have a power and ground check point, and it should be as close as possible to the components, and most fortunately, within 2.54mm;
(4) Try to lead the SMC/SMD inspection point on the component surface to the welding surface through the via hole, the diameter of the via hole is greater than 1mm, and the single-sided needle bed can be used for inspection to reduce the inspection cost;
(5) The power supply line on the PCB circuit board should be set up with check breakpoints in different regions, so that the power supply can be decoupled or blocked. When setting breakpoints, consideration should be given to the power-carrying capacity after the breakpoint is recovered and checked.
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