source:Industry News release time:2023-07-18 Article author:yu Popular:pcb
With the increase in the density of programmable devices and the number of I/O pins, Ball Gate Array (BGA) packaging is an ideal packaging solution for I/O interconnection within the device, which increases the number of pins and the area ratio of the circuit board. So, what are the advantages of PCB circuit board BGA packaging?
1. Pins are not easily damaged. BGA pins are sturdy solder balls that are not easily damaged during operation.
2. There are more pins per unit area. The solder ball is closer to the edge of the package, and the pin spacing of flip soldering BGA is reduced to 1.0mm, thereby increasing the number of pins.
3. A cheaper surface mount device. During the assembly process, BGA packaging can withstand small device misalignment and can use low-cost surface mount devices.
4. Smaller contacts. BGA packaging is generally 20% to 50% smaller than QFP packaging, making it more suitable for applications that require high performance and small contacts.
5. Integrated circuit speed advantage. BGA packaging adopts ground plane, ground loop, and power loop in its structure, which has good electrical performance.
6. Improved heat dissipation performance. The core is located at the center of the BGA package, while most GND and V CC pins are located at the center of the package, allowing the heat generated by the device to pass through GND and V CC
Pins scatter into the surrounding environment.
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