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Cleaning mechanism of solder joints in SMT processing

Cleaning mechanism of solder joints in SMT processing

In the process of SMT patch processing, because there are auxiliary agents such as flux, some pollutants or spots will be gen

2021-04-26

PCBA repair and rework process

PCBA repair and rework process

1. The purpose of PCBA repair and rework process ① The solder joint defects such as open circuit, bridge, virtual solder and

2021-04-26

What is HDI circuit board?

What is HDI circuit board?

High-density interconnection (HDI) PCB is a (technology) for the production of printed circuit boards, a circuit board with a

2021-04-26

Basic requirements for BGA pad design

Basic requirements for BGA pad design

1. The center of the pad of each solder ball on the PCB coincides with the center of the corresponding solder ball at the bot

2021-04-26

Method for saving PCB manufacturing cost

Method for saving PCB manufacturing cost

PCBA production cost has always been a major link in the total cost of electronic equipment, because it is the core component

2021-04-26

The main core point of SMT process

The main core point of SMT process

Among SMT manufacturers, especially those with PCB labor and materials, if they can manage and control all the production pro

2021-04-26