AOI circuit board,Automotive lighting PCB,Electronic assembly PCB,Socket terminal PCB-Shenzhen Weienchen Technology Co., Ltd.

Tel: +86-755-29662580

Email: sales@victoriapcb.com

current position: Home  》  News  》  FAQ

Basic requirements for BGA pad design

source:FAQ release time:2021-04-26 Article author:Victoria Popular:pcb

1. The center of the pad of each solder ball on the PCB coincides with the center of the corresponding solder ball at the bottom of the BGA.


2. The PCB land pattern is a solid circle, and the via hole cannot be processed on the land.


3. After the via hole is electroplated, it must be blocked with dielectric materials or conductive glue, and the height must not exceed the height of the pad.


4. Generally, the diameter of the pad is less than 20% to 25% of the diameter of the solder ball. The larger the pad, the smaller the wiring space between the two pads.


5. The number of wiring between two pads is calculated as P-D≥(2N+I)Xr where P is the pitch of the solder balls: D is the diameter of the pad: N is the number of wiring: X is the line width


6. General rules: The diameter of PBGA pads is the same as the pads on the device substrate.


7. The width of the wire connected to the pad should be the same, generally 0.15~02mm.


8. The solder mask size is 0.1~0.15mm larger than the pad size.


9. The design of CBGA pads must ensure that the opening of the template is such that the solder paste print volume is greater than or equal to 0.08mm2 (this is the minimum requirement) to ensure the reliability of the solder joints after PCBA processing products. Therefore, the pad of CBGA is larger than that of PBGA.


10. Set the positioning line of the outer frame.


Setting the external positioning line is very important for the inspection after SMT placement. The outer positioning line of BGA/CSP is shown in the figure.

BGA焊盘设计的基本要求(图1)

The size of the positioning frame is the same as the chip shape. The line width is 0.2~0.25mm; the 45° chamfer indicates the direction of the chip. There are two types of outer frame positioning lines: silk screen and copper coating. The former will cause errors. The latter is more precise. In addition, 2 Mark points should be set outside the positioning frame.


In addition, after the editor of Jingbang Electronics shared the above knowledge with you today, I have a whim today. I am always here to share some knowledge about SMT patch processing with you. Have you thought about it yourself? What problems are often encountered in the PCBA manufacturing process? Below I will take the initiative to share with you some of the problems we encountered in the patch processing at the beginning, and made a brief overview. I hope that friends who know can positively reply and comment!




1. What are the technical requirements for applying solder paste? What are the requirements for environmental temperature, humidity, and environmental sanitation for solder paste?


2. How to select, use and store solder paste correctly? What is the purpose of reheating after taking out the tin tone from the refrigerator before use?


3. Briefly describe the three methods of applying solder paste and the scope of application. Which method is currently the most widely used?


4. What are the principles of solder paste printing and the three key elements for the success of solder paste printing?


5. What printing parameters need to be set for the automatic printing machine? What are the operating steps and requirements for graphic alignment?


6. What are the methods to check the printing quality of solder paste? What are the treatment methods for unqualified products?


7. What are the main factors that affect the quality of solder paste printing? What influence does the degree of solder paste and adhesion have on the quality of printing?


8. How to choose the size of the alloy powder in the solder paste according to the assembly density?


9. What are the advantages and disadvantages of the metal secondary knife and the rubber scraper?


10. Briefly describe the judgment and adjustment methods of the main defects and defective products of the printed solder paste.


11. Briefly describe the main application occasions of the solder paste dispensing process of the manual dispenser. Briefly explain its operation method.


Read recommendations:

Six-layer Immersion Gold Board (BGA)

Six-layer Immersion Gold Board (BGA)

Six-layer Immersion Gold Board (BGA)

SMT stickers

What are the advantages of high-precision PCB multilayer circuit boards.Circuit board plug-in compan

Previous:Method for saving PCB manufacturing cost Back to list Next:What is HDI circuit board?

Online message

Popular recommended products

Related Information

what is pcb

2022-09-30

Where is the quality assurance of chip processing factories in PCBA processing and production?

2022-09-30

What aspects should a good PCB circuit board manufacturer identify?

2022-09-28

Analysis of Deformation Causes of Circuit Boards in PCBA Processing in Chip Processing Plants

2022-09-27

SMT PCBA processing factory SMT process workshop placement machine processing production standards

2022-09-26

What role does proofing play in the production process of the chip factory during pcba processing?

2022-09-24

What problems are prone to occur in the design of circuit board pcb proofing?

2022-09-23

PCB application

2022-09-22

Simple classification of PCBs

2022-09-22

How to make up for car PCB circuit board defects

2022-09-21

How pcb board manufacturers control the accuracy of pcb copy board

2022-09-21

What factors need to be considered in the production of multi-layer circuit boards

2022-09-20

What is the difference between wave soldering and manual soldering in PCBA processing by smt chip fa

2022-09-20

How to quote for PCB board?Automotive lighting PCB

2022-09-19

How to deal with the BGA on the PCBA circuit board that needs to be repaired and disassembled?

2022-09-19

What factors should be paid attention to in PCB circuit board design

2022-09-17

Some small principles of PCB copying process

2022-09-17

Common problems and solutions of copper plating technology in PCB circuit board process

2022-09-16

printed circuit board

2022-09-15

The distinction and pros and cons of circuit boards

2022-09-14

PCB circuit board copper cladding should pay attention to those problems

2022-09-14

What should be paid attention to before circuit board proofing manufacturers.One-stop contract PCB

2022-09-13

Printed circuit board knowledge to know when purchasing.Electrolytic capacitor PCB

2022-09-13

Blind hole board production knowledge in Shenzhen circuit board factory

2022-09-07

How to choose the right PCB factory when proofing the circuit board

2022-09-07

Circuit board factory: analysis of current and voltage feedback judgment points.X-ray inspection PCB

2022-09-06

Detailed explanation of horizontal electroplating line process for high-precision multi-layer circui

2022-09-06

How to Improve Etching Process Quality Analysis

2022-09-05

The whole process of manual PCB patch production that PCB whites must know

2022-09-05

Common problems and solutions in PCBA processing

2022-09-01