What is HDI (High Density Interconnect) PCB circuit board?
High-density interconnection (HDI) PCB is a (technology) for the production of printed circuit boards, a circuit board with a relatively high line distribution density that uses micro-blind via and buried via technology. Due to the electrical requirements of high-speed signals due to the continuous development of technology, circuit boards must provide impedance control with alternating current characteristics, high-frequency transmission capabilities, and reduction of unnecessary radiation (EMI). With the structure of Stripline and Microstrip, multi-layer design becomes a necessary design. In order to reduce the quality problems of signal transmission, insulating materials with low dielectric coefficient and low attenuation rate are used. To cope with the miniaturization and arraying of electronic components, the density of circuit boards is continuously increased to meet demand.
It adopts modular and parallel design. One module has a capacity of 1000VA (1U height) and is naturally cooled. It can be directly placed in a 19" rack, and 6 modules can be connected in parallel. The product uses full digital signal processing (DSP) technology and multiple This patented technology has a full range of adaptable load capacity and strong short-term overload capacity, regardless of load power factor and crest factor.
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