source:Industry News release time:2022-10-28 Article author:yu Popular:pcb
What aspects should be tested when accepting PCBA processed products? Chang Ke Shun would like to share the acceptance standards of PCBA processed products in patch processing factories:
I. Inspection environment:
1, test environment: temperature :25±3℃, humidity: 40-70%RH
2. Within 1m distance from 40W fluorescent lamp (or equivalent light source), the product under inspection is 30cm away from the inspector for appearance determination
2. Sampling level:
QA sampling standard: Execute GB/T2828.1-2003 Grade II test sampling plan
AQL value: CR:0 MAJ: 0.25 MIN:0.65
Three, inspection equipment:
BOM list, magnifying glass, feeler, patch location map
Iv. Acceptance Criteria:
1. The reverse:
The polarity point on the element (white screen printing) is in the same direction as the diode screen printing on the PCB board (acceptable).
The polarity point on the element (white screen printing) is not consistent with the diode screen printing on the PCB board. (refused)
2. Too much tin:
Maximum height solder joint (E) may extend beyond the top of the PAD or end cap metal coating extending to the solderable end, but not touching the element body (acceptable)
The solder has reached the top of the element body. (refused)
3. The reverse:
If there are exposed storage electrical materials, the Chip components shall mount the material surface in the opposite direction to the printed surface. Only one component ≤0402 is allowed to reverse white for each piece of CHIP parts. (acceptable)
For exposed stored electrical materials, the Chip components shall mount the material surface in the same direction as the printed surface, and two or more components ≤0402 shall be anti-white for each Pcs board of CHIP parts. (refused)
4. Air welding:
The welding point between the component pin and PAD is moist and full, and the component pin is not cocked (acceptable).
Element pin arrangement is not coplanar, preventing acceptable welding. (refused)
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