source:Industry News release time:2024-07-09 Article author:yu Popular:pcb
The process of making a PCB board (printed circuit board) usually includes the following main steps:
1. Design: Designers use CAD software to draw circuit design diagrams, determine the position and connection method of circuit components.
2. Plate making: Produce the designed circuit diagram into a film (similar to a transparent film template) for subsequent graphic transfer.
3. Drilling: According to the circuit design diagram, drill corresponding holes on the copper clad plate, which will be used for installing electronic components or as conductive holes to connect circuits of different layers.
4. Copper sinking: A thin layer of copper is deposited on the surface of the board after drilling, in order to form a conductive path in the non-conductive area.
5. Graphic transfer: Transfer the circuit pattern from the film to the copper-clad board, usually achieved using photosensitive resin and UV exposure.
6. Etching: By using chemical or electrochemical etching methods, the copper layer that has not been covered by pattern transfer is removed to form a circuit pattern.
7. Tin/Gold Plating: In order to protect the circuit board and enhance its soldering performance, a layer of tin or gold is usually plated on the surface of the circuit board.
8. Screen printing: Printing component identification and other necessary information on a circuit board for subsequent assembly and maintenance.
9. Assembly: Solder various electronic components onto the circuit board to form a complete electronic device.
10. Testing: Perform functional testing on the assembled circuit board to ensure its normal operation.
11. Packaging: Package the tested circuit boards and prepare them for delivery to customers or enter the next production process.
The above is a common PCB board manufacturing process, and the specific steps may vary depending on different manufacturing processes and requirements.
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