source:Industry News release time:2024-07-22 Article author:yu Popular:pcb
Printed circuit boards need to continuously consume various substances in the solution during the process of chemical copper plating. During the operation, timely analysis and testing should be carried out according to the production volume to supplement and maintain the stability of the solution.
As production continues, the chemical copper plating solution is repeatedly used. Frequent addition of chemical substances will gradually increase various impurities in the solution. It is necessary to replace some of the old solution appropriately after a certain production cycle to increase the activity of the chemical copper plating solution and ensure the quality of the chemical copper plating layer.
After the chemical copper plating work is completed, dilute sulfuric acid can be used to adjust the pH value to below 10. After the reaction of the chemical copper plating solution stops, filter out the particulate matter in the solution in a timely manner. When reusing, slowly adjust the pH value to the process range with dilute alkali and continuous stirring.
In short, whether it is chemical plating of thin copper or chemical plating of thick copper, the chemical copper plating solution should be prepared correctly according to the process specifications; Strictly control the process conditions; Carefully maintain the chemical copper plating solution; Strengthen the pre-treatment and post-treatment of chemical copper plating on printed circuit boards. These are the key to ensuring the final quality of the product.
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