Detailed explanation of PCB board sampling production process_

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Detailed explanation of PCB board sampling production process

source:Industry News release time:2024-06-11 Article author:yu Popular:pcb

　　 Detailed explanation of PCB board sampling production process(图1)

　　1、 Line

　　1. Minimum line width: 6mil (0.153mm). That is to say, if the line width is less than 6mil, production cannot be carried out. If the design conditions permit, the larger the design, the better. The larger the line width, the better the factory can produce, and the higher the yield. Generally, the design standard is around 10mil. This is very important, and the design must consider it

　　2. Minimum line spacing: 6mil (0.153mm). The minimum line spacing is the distance from line to line and from line to solder pad, which should not be less than 6mil. From a production perspective, the larger the distance, the better. Generally, it is 10 mil. Of course, if there are conditions in the design, the larger the better. This is very important, and the design must consider it

　　3. The distance between the line and the outer line is 0.508mm (20mil)

　　2、 Via via (commonly known as conductive hole)

　　1. Minimum aperture: 0.3mm (12mil)

　　2. The minimum through-hole (VIA) aperture should not be less than 0.3mm (12mil), and one side of the solder pad should not be less than 6mil (0.153mm), preferably greater than 8mil (0.2mm). If it is large, it is not limited (see Figure 3). This is very important and must be considered in the design

　　3. VIA hole to hole spacing (from hole edge to hole edge) should not be less than: 6mil, preferably greater than 8mil. This is very important and must be considered in the design

　　4. The distance between the solder pad and the contour line is 0.508mm (20mil)

　　5. a. Hole to line spacing:

　　NPTH (without welding ring): hole compensation of 0.15mm and above 0.2mm from the line

　　PTH (with welding ring): hole compensation of 0.15mm and above 0.3mm from the line

　　b. Hole to hole spacing:

　　PTH (with welding ring): After compensating the hole by 0.15mm, the hole should be at least 0.45mm from the hole to the hole

　　NPTH hole: After hole compensation of 0.15mm, the hole should reach 0.2mm or more

　　VIA: The spacing can be slightly smaller

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