source:Industry News release time:2022-04-15 Article author:yu Popular:pcb
SMT chip processing is the core technology in the SMT process, and the speed of chip processing often restricts the capacity of the production line.
An SMT chip processing production line must have at least one high-speed placement machine for placing regular-size components and a multi-function placement machine for placing special-size components. In the process of SMT patch processing, various problems will always be encountered. The following panel factory editor will introduce to you the causes and solutions of these common problems.
1. Poor wetting of PCBA processing
Phenomenon: During the welding process, there is no reaction between the substrate welding area and the metal after the solder is wetted, resulting in less welding or missing welding.
Cause Analysis:
(1) During wave soldering, there is gas on the surface of the substrate, which is also prone to poor wetting.
(2) When the residual metal in the solder exceeds 0.005%, the activity of the flux decreases, and poor wetting will also occur.
(3) The surface of the welding area is contaminated, the surface of the welding area is stained with flux, or a metal compound is formed on the surface of the chip component. cause poor wetting. For example, sulfides on the surface of silver and oxides on the surface of tin will cause poor wetting.
PCBA processing/SMT patch
PCBA processing/SMT patch
solution:
(1) Strictly implement the corresponding welding process;
(2) The surface of pcb circuit boards and components should be cleaned;
(3) Select the appropriate solder, and set a reasonable soldering temperature and time.
2. Tombstone
Phenomenon: One end of the component does not touch the pad and is inclined upward or has contacted the pad and is upright.
Cause Analysis:
(1) It is related to the wettability of solder paste;
(2) The shape of the electronic components themselves is prone to tombstones;
(3) The temperature rises too fast during reflow soldering, and the heating direction is unbalanced;
(4) Wrong choice of solder paste, no preheating before soldering and wrong choice of solder area size.
Solutions for PCBA Processing:
1. Reasonably set the printing thickness of the solder;
2. Reasonably formulate the temperature rise of the reflow area;
3. Store and access electronic components as required;
4. Reduce the surface tension on the end of the component when the solder melts;
5. The PCB circuit board needs to be preheated to ensure uniform heating during soldering.
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