With the continuous improvement of humans' requirements for the living environment, the environmental problems involved in the current PCB production process are particularly prominent. The topic of lead and bromine is the hottest. Lead -free and halogen will affect the development of PCB in many ways. QQ: 2355957872 Miss Lan, although at present, the changes in the surface processing process of PCB are not great, it seems to be relatively far away, but it should be noted that long -term slow changes will lead to huge changes. In the case of increasingly higher environmental calls, the surface treatment process of PCB will definitely change in the future. The most basic purpose of surface treatment is to ensure good weldability or electrical properties. Because copper in nature tends to exist in the form of oxides in the air, it is unlikely to be maintained as the original copper for a long time, so it needs to be treated with copper. Although in the subsequent assembly, a strong welding can be used to remove the oxides of most copper, but the strong welding itself is not easy to remove. Therefore, the industry generally does not use strong welding. There are many PCB surface treatment processes. The common five processes of hot air are flat, organic coating, chemical nickel plating/immersion gold, silver and soaked, and tin, and will be introduced one by one. 1. The heat wind is flat (tin spray) the heat wind is flat, and the hot air weld is flat (commonly known as tin spray). It forms a layer of anti -copper oxidation and good weldability coating layer. The whole weld and copper of the hot air form a copper -tin metal interductive compound at the combination. PCB is usually sinking in the melting welded water; the wind knife blows the liquid welded flat liquid welded before the welded; 2. Organic welded protective (OSP) OSP is a process that complies with the ROHS instruction requirements of the surface processing of copper foil (PCB) of the printing circuit board (PCB). OSP is the abbreviation of Organic Soldrability Preservatives. Chinese translations are organic welded films, also known as copper caregivers, and English also known as preflux. To put it simply, OSP is a layer of organic skin film on the surface of clean nude copper. This membrane has anti -oxidation, heat resistance, and humidity resistance to protect the surface of copper in the normal environment and no longer continue to rust (oxidation or vulcanization, etc.); It is easy to be quickly removed by the welding agent, so that the clean copper surfaces exposed can be immediately combined with a solid welding joint with the melting welding in a very short period of time. 3. The nickel -plated nickel -plated nickel -plated gold in the whole plate is placed on the PCB surface conduction first, then placed a layer of nickel, and then placed a layer of gold. Nickel plating is mainly to prevent the diffusion between gold and copper. There are two types of electroplating gold now: soft gold (pure gold, the surface of gold does not look bright) and hard gold plating (smooth and hard on the surface, wear resistance, containing cobalt and other elements, and the gold surface looks brighter). Soft gold is mainly used for chip packaging; hard gold is mainly used for electrical interconnection at non -welding. 4. Shen Jin Ban Shen Jin is wrapped on a thick layer of nickel gold alloy with good electrical, which can protect PCB for a long time; in addition, it also has the patience of the environment that does not have the environment that does not have the environment. Essence In addition, Shen Jin can also prevent the dissolution of copper, which will be beneficial to lead -free assembly. 5. Because all current solder is based on tin, the tin layer can match any type of solder. Shen Xi's crafts can form a flat copper -tin interductive compound. This characteristic makes Shenxi has the same good weldability as well as the hot air without the flattelling of the headache. When assembling, it must be carried out in the order of Shen Xi. 6. Shen Yinban Shenyin's process is between organic coating and chemical nickel plating/Shen Jin. The craftsmanship is relatively simple and fast. , But it will lose luster. Shen Yin does not have the good physical strength of chemical nickel plating/Shen Jin because there is no nickel under the silver layer. 7. Chemical nickel golden chemical nickel gold and Shen Jin have a layer of 钯 between nickel and gold. 钯 can prevent corrosion phenomenon caused by replacement reactions, and make full preparations for Shen Jin. Gold is tightly covered on the 的, providing a good contact surface. 8. In order to improve the wear resistance of the product, the electroplating hard gold board increases the number of plug -in times, and the electroplating hard gold. As the user's requirements are getting higher and higher, the environmental requirements are getting stricter and more and more surface treatment technology. In the end, it is necessary to choose the surface processing process with strong development prospects and stronger. Essence Where the PCB surface treatment process will go in the future, it is not possible to accurately predict. In any case, to meet the requirements and protect the environment of users must be done first!

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