Explanation and method of FPC production imposition

　　In the production process of FPC, in order to save costs, improve production efficiency, and shorten the production cycle, there will be imposition production instead of monolithic production. In FPC imposition, there are several principles that need to be followed.

　　1. Under the premise that each process can be produced, the circuit board imposition should be "squeezed" as much as possible. The so-called "squeeze" is to reduce the distance between adjacent boards and circuit boards, thereby reducing the size of the entire panel, saving production materials, thereby reducing production costs.

　　2, the spacing between the single plates is at least more than 2.5mm. First of all, this is to meet the needs of positioning holes. In the mass production process, the molding generally adopts the method of die punching. In order to enhance the accuracy of die punching, positioning holes need to be placed between each piece in the imposition to avoid die punching. In the process of sample production, laser cutting is generally used. In order to avoid slight deviation and prevent the deviation of one piece and the whole piece, the single pieces cannot be directly connected, so that the two pieces are mutually exclusive. Influence.

　　3, FPC imposition needs to add etched characters, and a brief description of the imposition size, quantity, etc., so as to facilitate verification and verification in subsequent production.

　　4. Add positioning holes at the four corners of the entire imposition, and choose one corner to mark different positioning holes, which is convenient for maintaining the same direction in the subsequent production process, so as not to cause the sealing film to be stuck back, and the characters are printed back.

　　5, the imposition width is fixed at 250mm, and the length is within 250mm as much as possible. The larger the imposition size, the greater the offset, the worse the production accuracy, and the higher the defective rate of finished products.

　　After reading the previous, everyone should know a little bit about it. Here is a brief introduction to the three ways of FPC imposition.

　　1. Regular imposition. Directly align the layout according to the direction of the single chip, which is most suitable for FPC layout with regular appearance, such as rectangle, square, circle, ellipse, etc.;

　　2, diagonal spelling. The single piece is tilted to a certain degree, and then arrayed, so as to maximize the use of the imposition space, such as curved strips, folds, etc.;

　　3. Reverse spelling. That is, a single PCS is combined with one positive and one negative to jiggle together.

　　All the imposition methods, under the premise of being able to produce, follow the principle of saving materials.

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