source:Industry News release time:2021-09-13 Article author:sznbone Popular:pcb
Explanation and method of FPC production imposition
In the production process of FPC, in order to save costs, improve production efficiency, and shorten the production cycle, there will be imposition production instead of monolithic production. In FPC imposition, there are several principles that need to be followed.
1. Under the premise that each process can be produced, the circuit board imposition should be "squeezed" as much as possible. The so-called "squeeze" is to reduce the distance between adjacent boards and circuit boards, thereby reducing the size of the entire panel, saving production materials, thereby reducing production costs.
2, the spacing between the single plates is at least more than 2.5mm. First of all, this is to meet the needs of positioning holes. In the mass production process, the molding generally adopts the method of die punching. In order to enhance the accuracy of die punching, positioning holes need to be placed between each piece in the imposition to avoid die punching. In the process of sample production, laser cutting is generally used. In order to avoid slight deviation and prevent the deviation of one piece and the whole piece, the single pieces cannot be directly connected, so that the two pieces are mutually exclusive. Influence.
3, FPC imposition needs to add etched characters, and a brief description of the imposition size, quantity, etc., so as to facilitate verification and verification in subsequent production.
4. Add positioning holes at the four corners of the entire imposition, and choose one corner to mark different positioning holes, which is convenient for maintaining the same direction in the subsequent production process, so as not to cause the sealing film to be stuck back, and the characters are printed back.
5, the imposition width is fixed at 250mm, and the length is within 250mm as much as possible. The larger the imposition size, the greater the offset, the worse the production accuracy, and the higher the defective rate of finished products.
After reading the previous, everyone should know a little bit about it. Here is a brief introduction to the three ways of FPC imposition.
1. Regular imposition. Directly align the layout according to the direction of the single chip, which is most suitable for FPC layout with regular appearance, such as rectangle, square, circle, ellipse, etc.;
2, diagonal spelling. The single piece is tilted to a certain degree, and then arrayed, so as to maximize the use of the imposition space, such as curved strips, folds, etc.;
3. Reverse spelling. That is, a single PCS is combined with one positive and one negative to jiggle together.
All the imposition methods, under the premise of being able to produce, follow the principle of saving materials.
Read recommendations:
Laminate copper-based PCB after 4L (sample)
Aluminum substrate (double-sided)
Popular recommended products
Network communication board (sixth floor)
2021-04-29Six-layer Immersion Gold Board (BGA)
2021-05-27Six-layer Immersion Gold Board (BGA)
2021-05-27Six-layer Immersion Gold Board (BGA)
2021-04-27Six-layer Immersion Gold Board (BGA)
2021-05-24High frequency PCB
2021-04-27High frequency PCB
2021-04-27Display board (six layers)
2021-04-27Computer card board (four layers)
2021-04-25High frequency PCB
2021-04-27Single copper base PCB
2021-04-27Six-layer Immersion Gold Board (BGA)
2021-05-24Silver oil perforated plate (double-sided)
2021-04-27Six-layer Immersion Gold Board (BGA)
2021-05-27Single-sided double-layer AL base PCB
2021-04-27Mobile phone template (six layers)
2021-04-27Six-layer Immersion Gold Board (BGA)
2021-04-27Six-layer Immersion Gold Board (BGA)
2021-04-27High frequency PCB
2021-04-27Aluminum substrate (double-sided)
2021-04-27Six-layer Immersion Gold Board (BGA)
2021-04-27Six-layer Immersion Gold Board (BGA)
2021-05-27Laminate copper-based PCB after 4L (sample)
2021-04-27SMT stickers
2021-05-27SMT stickers
2021-05-27Six-layer Immersion Gold Board (BGA)
2021-04-26Six-layer Immersion Gold Board (BGA)
2021-04-26Mobile phone board
2021-04-27Mobile phone board
2021-05-27Six-layer Immersion Gold Board (BGA)
2021-04-26DIP plugin
2021-05-27DIP plugin
2021-05-27Six-layer Immersion Gold Board (BGA)
2021-04-26Six-layer Immersion Gold Board (BGA)
2021-04-26Related Information
The relationship between PCB safety distance and voltage
2024-04-22SMT surface mount processing.Hybrid circuit board PCB
2024-04-15PCB enterprises should pay attention to SMT matters.Electronic components PCB
2024-04-03PCB - the core building block of electronic products.Automotive Electronics PCB
2024-03-25PCB - the bridge and link of the electronic world
2024-03-18How to define high-frequency and high-precision circuit boards.Industrial Electronics PCB
2024-03-11USB PCB interface layout and wiring requirements
2024-01-22Electrolytic capacitor PCB.Steps for using PCB pins
2024-01-15Automotive ElectronicWhat aspects should be considered when processing and manufacturing PCB boards?
2024-01-08Electrolytic capaciWhat is the difference between a gold-plated circuit board and a gold-plated one?
2023-12-25When grinding PCB boards, attention should be paid to.Oscillator (belonging to crystal) PCB
2023-12-18Industrial Electronics PCB!What precautions should be taken when copying and grinding PCB boards
2023-12-11Do you know who is more suitable for LED direct display, regarding the difference between PCB board
2023-12-05Aluminum electrolytic capacitor PCB.What are the standards for selecting PCB boards
2023-11-27Surface Mount Technology (SMT) Phase PCB
2023-11-20Oscillator (belonging to crystal) PCB.The main functions of PCB board
2023-11-13What is the difference between RO filter and PCB filter
2023-11-06Method for determining blind hole PCB board
2023-11-01Electronic Manufacturing Services PCB!What are the effects of PCB board color on performance?
2023-10-23Introduction to the Manufacturing Steps and Requirements of PCBA Test Stand
2023-10-16PCB version maturity stage.AOI circuit board price
2023-09-25How to maintain a PCB circuit board
2023-09-19Development Trend of Printed Circuit Board.Zener diode PCB Vendor
2023-09-14Common problems and cause analysis of PCB circuit board sampling.Zener diode PCB price
2023-09-08What are the issues that need to be understood in PCB circuit board design?IGBT module PCB factory
2023-09-08How to reduce the risk of bending and deformation in PCB circuit board production?Inverter PCB Produ
2023-08-16What are the three main factors that constitute welding defects in PCB circuit boards?Multilayer PCB
2023-08-16The structure of a glass teapot.LCD Module PCB factory
2023-08-11Glass teapot.Inverter PCB Processing
2023-08-11PCB online debugging
2023-08-08
CopyRight © 2007-2024Shenzhen Weienchen Technology Co., Ltd.
粤ICP备2021061255号
Address:
1205, Floor 12, Building 3, Chuangyi Office Building, No. 110, Ziheng West Road, Jinsha Community, Kengzi Street, Pingshan District, Shenzhen, Guangdong, China
Tel:
+86-755-29662580
Email:
sales@victoriapcb.com
PCB
PCBA
Service
Process
Tel: +86-755-29662580
Email: sales@victoriapcb.com
中
current position:
