source:Industry News release time:2021-04-27 Article author:Victoria Popular:pcb
Solder paste is a new type of soldering material that came into being with SMT. It is mainly used in the reflow soldering of electronic components such as PCB processing surface resistance, capacitors, and ICs in the SMT chip processing industry. The solder paste is formulated according to its viscosity, fluidity and the type of missing plate during printing, and can usually be classified according to the following properties:
(1) Classified by melting point of alloy solder. According to the melting point, solder paste is divided into high temperature solder paste (above 217℃), medium temperature solder paste (173~200℃) and low temperature solder paste (138~173℃). The most commonly used solder paste has a melting point of 178~183°C. Depending on the type and composition of the metal used, the melting point of the solder paste can be increased to 250°C or higher, or lower to 150°C, depending on the temperature required for soldering. Choose solder pastes with different melting points.
(2) Classified by flux activity. Solder paste can be divided into R grade (inactive), RMA grade (medium active), RA grade (fully active) and SRA grade (super active) according to flux activity. In general, R grade is used for welding of aerospace and avionics products, RMA grade is used for military and other high-reliability circuit components, and RA and SRA grades are used for consumer electronic products. When used, it can be used according to the PCB and components. Conditions and cleaning process requirements to choose.
(3) Classified according to the viscosity of solder paste. The viscosity of solder paste varies widely, usually from 100 to 600 Pa·s, up to 1000 Pa·s or more. The use time can be selected according to the different methods of applying cream.
(4) Classified by cleaning method. According to the cleaning method, solder paste can be divided into organic solvent cleaning, water cleaning, semi-aqueous cleaning and no-cleaning. Among them, organic solvent cleaning products such as traditional rosin solder paste, water cleaning products have strong activity, and can be used with surfaces that are difficult to braze. Semi-aqueous cleaning products and no-clean products are the development direction of electronic product technology.
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