source:Industry News release time:2022-05-28 Article author:yu Popular:pcb
The first is the internal thermal soldering iron. For the current circuit board technology, the soldering iron tip of the thermal soldering iron is relatively large and thick, but the circuit board components at that time were discrete and relatively large, so they could be used. Later, the tin throwing method was often used. The specific operation is as follows: dip the soldering iron tip in the rosin box, then shake the soldering iron quickly, and the solder on the soldering iron tip will be thrown into the rosin. After that, use a soldering iron tip to eat tin on the original pins that need to be removed, and the original solder can be sucked away after repeated several times.
Then, the tin suction device comes on stage. It was something like a syringe that sucked the melted solder into the cavity using suction. The use is to heat the solder with a soldering iron to a molten state, and then quickly remove it with a tin remover.
Then someone invented the tin absorption tape, which is a copper wire mesh similar to the outer skin of a shielded wire. Pure copper is particularly easy to eat tin, and the interior is hollow and has a lot of space. The suction capacity is large and clean! When using, put the tin absorption tape on the pad, and the soldering iron is directly heated on the tin absorption tape. After the solder melts, it will be adsorbed by the tin absorption tape immediately. When not available, you can also use multiple strands of soft copper wire instead. Smaller circuit boards can also be shaken to remove tin. After the pad solder is heated, shake it on the table lightly, and the melted solder will flow down. The large area of tin removal can be heated as a whole, and the solder will flow down after melting. To achieve rapid tin removal, the purpose of taking the original. It should be noted that solder and pine fumes are poisonous, so pay attention to ventilation when using.
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