Introduction to ICT Testing Technology in PCBA Testing_

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Introduction to ICT Testing Technology in PCBA Testing

source:Industry News release time:2022-03-13 Article author:sznbone Popular:pcb

　　During the ICT test, the test probes are mainly used to contact the test points on the PCBA board, and faults such as short circuits, open circuits and component welding can be detected. It can quantitatively measure resistors, capacitors, inductors, crystal oscillators and other devices, perform functional tests on diodes, triodes, optocouplers, transformers, relays, operational amplifiers, power modules, etc., and perform functional tests on small and medium-sized integrated circuits, such as all 74 series, Memory class, common driver class, switching class and other ICs.

　　Some of the methods of ICT testing are;

　　1. Simulation device test

　　Test with an op amp. The concept of "virtual ground" from "A" point is:

　　∵Ix = Iref

　　∴Rx = Vs/ V0*Rref

　　Vs and Rref are the excitation signal source and the instrument calculation resistance, respectively. After measuring V0, Rx can be obtained. If Rx to be measured is capacitance or inductance, then Vs is the AC signal source, and Rx is in the form of impedance, and C or L can also be calculated.

　　2. Vector test

　　For digital ICs, the Vector test is used. The vector test is similar to the truth table measurement, which stimulates the input vector, measures the output vector, and judges the quality of the device through the actual logic function test. Such as: NAND gate test

　　For the test of the analog IC, the voltage and current can be stimulated according to the actual function of the IC, and the corresponding output can be measured as a functional block test.

　　3. Non-vector test

　　With the development of modern manufacturing technology and the use of VLSI, it often takes a lot of time to write the vector test program of the device. For example, the test program of 80386 takes nearly half a year for a skilled programmer. A large number of applications of SMT devices make the failure phenomenon of device pin open circuit more prominent. To this end, the non-vector testing technology of various companies, Teradyne launched MultiScan; GenRad launched the Xpress non-vector testing technology.

　　ICT testing is at the back end of the production process. The first process of PCBA testing can timely find problems in the production process of PCBA boards, which helps to improve the process and increase the efficiency of production.

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