Before the advent of printed circuit boards, the interconnections between electronic components depended on the direct connection of wires to form a complete circuit. In contemporary times, the circuit board only exists as an effective experimental tool, and the printed circuit board has become an absolute dominant position in the electronics industry.

　　At the beginning of the 20th century, in order to simplify the production of electronic machines, reduce the wiring between electronic parts, and reduce production costs, people began to study the method of replacing wiring by printing. In the past three decades, engineers have continuously proposed adding metal conductors on insulating substrates for wiring. The most successful was in 1925, when Charles Ducas of the United States printed circuit patterns on insulating substrates, and then successfully established conductors for wiring by electroplating.

　　Until 1936, the Austrian Paul Eisler (Paul Eisler) published the foil technology in the United Kingdom, he used a printed circuit board in a radio device; in Japan, Miyamoto Kisuke used the spray wiring method "メタリコン method". "Blowing Wiring Method (Patent No. 119384)" successfully applied for a patent. Among the two, Paul Eisler's method is the most similar to today's printed circuit boards. This method is called subtraction, which removes unnecessary metals; while Charles Ducas and Miyamoto Kisuke's method is to add only the required components. line, called the additive method. Even so, due to the high heat generation of electronic components at that time, the substrates of the two were difficult to use together, so there was no formal practical application, but it also made the printed circuit technology a step further.

　　Development of circuit boards:

　　In the past ten years, my country's printed circuit board (Printed Circuit Board, PCB) manufacturing industry has developed rapidly, and its total output value and total output have both ranked first in the world. Due to the rapid development of electronic products, the price war has changed the structure of the supply chain. China has both industrial distribution, cost and market advantages, and has become the most important printed circuit board production base in the world.

　　Printed circuit boards have developed from single-layer to double-sided circuit boards, PCB multi-layer circuit boards and flexible boards, and are constantly developing in the direction of high precision, high density and high reliability. Continuously shrinking the size, reducing the cost, and improving the performance will make the printed circuit board still maintain a strong vitality in the development of electronic products in the future.

　　In the future, the development trend of printed circuit board manufacturing technology is to develop in the direction of high density, high precision, small aperture, thin wire, small pitch, high reliability, multi-layer, high-speed transmission, light weight and thin shape.

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