source:Industry News release time:2021-12-13 Article author:sznbone Popular:pcb
1. Improve the ability to safely handle etched thin copper foils and thin laminates. When etching a thin laminate (such as the inner layer of a multilayer board), the board is easily wound on the drum and the feeding wheel, causing waste, and the inner layer board-level equipment smoothly and stably processes the thin laminate. Many equipment manufacturers add gears or rollers to their etching machines to prevent this from happening, and a better way is to use an additional oscillating PTFE coating. The sheath wire is used as a support for the transfer of the thin laminate. If you want to etch a thin copper foil (such as 1/2 or 1/4 ounce), you need to be careful not to scratch it. Thin copper foil cannot withstand the mechanical disadvantages of etching 1 ounce of copper foil, and vibration can sometimes scratch the copper foil.
2. Reduce pollution problems. Copper water pollution is a common problem in the production of printed circuits. The use of ammonia alkaline etching solution makes this problem more serious. Copper has a complex with ammonia, which is not easy to remove by ion exchange or alkaline precipitation. After washing the substrate with a copper-free additive solution, the secondary spray method is used to greatly reduce the discharge of copper. The air knife removes excess solution from the board surface before rinsing with water, reducing the water rinsing burden of copper and etching salts.
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