With the escalation and rapid expansion of the global electronic product market, the miniaturized, high-precision, ultra-fine circuit printed circuit board technology of electronic products is entering a period of rapid development. In order to meet the ever-increasing demands of the market, especially in the field of ultra-fine circuit technology, traditional and backward etching technology is being replaced by advanced vacuum etching technology. Therefore, as a first-line PCB circuit board manufacturer, Honglian Circuit will take you to understand the details of this technology

　　Everyone knows that the surface of the copper clad laminate is not required in all places. In order to appear the circuit pattern, the circuit board manufacturer will remove the unnecessary copper conductors by chemical solution etching, leaving the copper conductors, which are formed by the subtraction method. Circuit patterns, called etching, are currently the mainstream of printed circuit board processing.

　　The key to etching is the etching solution, the operating conditions of the circuit board manufacturer and the etching equipment. At present, the main market is the acid copper chloride etching solution of copper chloride and hydrochloric acid, and the alkaline copper chloride etching solution of copper chloride and ammonia water as the mainstream. In the PCB manufacturer, the control of process parameters such as temperature, pressure, time and solution concentration makes the etching process in the best state. The etching equipment needs to be continuously improved around production efficiency, etching speed and etching uniformity. At present, the mainstream is the horizontal conveying spray type.

　　The German company PILL e.K. has released a new process technology that can improve the fluidity of the etching solution on the surface of the board by absorbing the used etching solution, thereby preventing the "pool effect" from occurring. This method is called vacuum etching.

　　This method is confirmed by the uniformity test of etching. The foil-clad laminates using 35μm copper foil are etched on both conventional and vacuum etching machines for full-board surface etching, and the copper foil in the middle of the board is etched to a thickness of 18μm. Full board copper thickness distribution. The copper thickness distribution obtained by conventional etching of PCB batch manufacturers is usually alpine in the center, while the copper thickness distribution obtained by vacuum etching is uniform. Within a length of 600mm, the thickness difference between the center and edge copper in conventional etching is about ±4μm (18-10μm), while the difference in thickness between the center and edge copper in vacuum etching is only about ±1μm (19-17μm), the latter is only four of the former. one part.

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