source:Industry News release time:2022-04-13 Article author:yu Popular:pcb
I have recently discussed this routing rule in detail in the article The Case Against Orthogonal Trace Routing in Multilayer PCBs [2], and some of the important conclusions are reproduced below. The rule of vertical wiring is that the traces on adjacent signal layers need to be perpendicular to each other to reduce crosstalk caused by mutual inductance. In high-frequency signals, crosstalk through capacitive coupling dominates, producing current spikes between vertical leads.
When the signal changes along the time, or the frequency is low (less than several GHz), the coupling capacitance interference of the vertical wiring components of the adjacent signal layers is small. In the radio frequency (RF) frequency band (tens of GHz), the interweaving of the leads produces hole resonance, and the conductor structure that is not surrounded by the ground wire will produce electromagnetic resonance at some special frequency points. At this time, even if the leads are vertical, strong crosstalk will be caused between them.
In order to eliminate interference at all frequency points, a simple and effective method is to use a multi-layer board and use an isolation layer between the signal layers. This is especially important in contemporary applications where signals are changing rapidly. When you are not sure about the coupling strength between orthogonal lines, you need to use basic crosstalk simulation software to check the vertical leads to see if the crosstalk between them is within the noise tolerance range. At this point, you need to plan the signal return path, which is a major problem in vertical routing.
2. Heat dissipation vias
This is a classic "do/avoid" rule that is often debated. Some PCB designers say they never use heat-prevention vias and have never had problems with soldering and assembly. Another group insists that thermal vias need to be used whenever each plane is connected. Who are they right?
Their views are applicable to different occasions. If you are soldering the board by hand, you will need to raise the temperature of the soldering iron tip to compensate for the soldering problems caused by the soldered vias dissipating heat from the copper layer. However, if you use wave soldering, you need to use anti-thermal vias to prevent device loosening, cold soldering, tombstones, etc., so I suggest you better bite the bullet and stick to the thermal-preventing via design.
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