source:Industry News release time:2022-06-11 Article author:yu Popular:pcb
1. metallized hole
The metallized hole is to deposit copper on the wall of the hole that runs through the wires or pads on both sides, so that the original non-metallic hole wall is metallized, also known as sinking copper. In double-sided and multi-layer PCBs, this is an essential process.
In actual production, a series of processes such as drilling, degreasing, roughening, immersion cleaning solution, hole wall activation, chemical copper deposition, electroplating, and thickening can be completed.
The quality of the metallized holes is crucial for double-sided PCBs, so it must be checked, requiring the metal layer to be uniform and complete, with reliable connection to the copper foil. In the surface mount high-density board, this metallization hole adopts the blind hole method (the copper sinking fills the entire hole) to reduce the area occupied by the via hole and increase the density.
2. metal coating
In order to improve the conductivity, solderability, wear resistance, decorative properties of the PCB printed circuit, prolong the service life of the PCB, and improve the electrical reliability, metal coating is often performed on the copper foil of the PCB. Commonly used coating materials are gold, silver and lead-tin alloys.
The fifth step of PCB fabrication is flux and solder mask treatment
After the surface of the PCB is coated with metal, flux or solder mask treatment can be performed according to different needs. Applying flux can improve solderability; on high-density lead-tin alloy boards, in order to protect the board surface and ensure the accuracy of soldering, solder resist can be added to the board surface to expose the pads, and other parts are under the solder mask. Solder resist coatings are divided into two types: heat-curing and light-curing, and the color is dark green or light green.
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