source:Industry News release time:2021-11-04 Article author:sznbone Popular:pcb
Pcb HDI cabling challenges and technologies
1. What is HDI wiring?
High-density interconnect (HDI) wiring refers to the use of modern design strategies and manufacturing techniques to achieve denser designs without affecting circuit functions. In other words, HDI involves the use of multiple wiring layers, smaller traces, vias, pads, and thinner substrates to install complex and typical high-speed circuits in a previously impossible footprint.
With the advancement of manufacturing technology, HDI wiring began to appear in many designs, such as motherboards, graphics controllers, smartphones, and other space-constrained devices. If implemented properly, HDI wiring can significantly reduce design space and reduce EMI issues on the PCB. Reducing costs is an important goal of the company, and HDI cabling can do this.
2. HDI wiring and micro vias
It is important to understand that HDI wiring is more complicated than typical multilayer wiring strategies. We can design 8-layer or 16-layer PCB, but we need to learn some new concepts related to HDI wiring.
The key driving force behind HDI wiring is the development of through-hole technology. Vias are no longer copper-plated holes drilled in various layers of the PCB. The traditional via mechanism reduces the wiring area on the unused PCB layer of the signal line.
In HDI wiring, micro-via is the focus of promotion for multi-layer high-density wiring integration. Micro vias can be considered to be composed of blind holes and buried holes, with different structural methods. However, before stacking the layers, we use a laser to drill micro-vias in each layer.
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