source:Industry News release time:2022-06-18 Article author:yu Popular:pcb
HDI circuit board is simply a multi-layer circuit board manufactured by lamination method and micro-blind via technology. That is to say, first obtain a core board with (without) plated through holes (PTH) according to the traditional method, and then add thin lines and micro-blind holes to the outer layers on both sides of the multilayer circuit board.
Definition of Micro Blind Via
Microvia refers to the hole with a diameter smaller than 150um (6mil) usually called microvia in the PCB (HDI circuit board) industry. General mechanical drilling cannot be completed.
Definition of Buried Via
Buried hole refers to the hole buried in the inner layer, which is generally invisible to the finished product. Compared with through holes, buried vias have the advantage of not occupying the surface area of the PCB (HDI circuit board), so more components can be placed on the surface of the PCB (HDI circuit board). Buried holes are generally mechanical holes with a diameter of 0.2mm or more.
Definition of blind hole
Blind holes, (HDI circuit boards) blind holes can be seen in the finished product. The difference with through holes is that the front and back sides of the through holes can be accessed, while the blind holes can only be seen on one side. Compared with through holes, blind vias have the advantage that wiring can also be made below the corresponding positions of blind vias. Generally, the mechanical blind hole is completed with a mechanical drill to control the depth, and the laser blind hole is obtained by laser.
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