Via technology in circuit board factory.Electrolytic capacitor PCB_

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Via technology in circuit board factory.Electrolytic capacitor PCB

source:Optimization dedicated release time:2022-04-18 Article author:yu Popular:pcb

　　

Via technology in circuit board factory.Electrolytic capacitor PCB(图1)

　　Looking at a complex PCB board, such as a computer's motherboard, you may find that several tracks have nowhere to go and terminate abruptly. However, close inspection with a magnifying glass will reveal more detail at the end of the track. Most likely, you'll see that it ends up with a small board pad, not much larger than the width of the track itself, with one or no hole in its center. This is about the via technology of the circuit board factory.

　　In fact, the track does not terminate, but continues to travel, albeit on a different layer, hidden beneath the outermost layer of the PCB. The ends of the pads are actually small tubes through insulating material that electrically connect the two parts of the track. In board prototyping terminology, this arrangement that allows the track to continue but on a different layer is called a board via.

　　Multilayer PCB circuit boards use different types of vias for various purposes. There may be through-hole vias, blind vias and buried vias in the same board. While all vias are constructed the same, their naming depends on the origin and termination layers. For example, vias originating from an outermost layer, passing through a board and terminating in another outermost layer are vias. During its passage through the layers of the board, it may or may not be connected to the intermediate layer, depending on the necessity of the circuit.

　　Blind vias come from one of the outermost layers, but end in the middle layer and are therefore only visible on the starting layer. It may or may not be connected to other layers in between. A buried via is not visible from either of the outermost layers because it originates in one inner layer and terminates in another inner layer, possibly connecting other layers in between. By design, the vias consist of two external pads and a copper tube that electrically connects them. The two outer pads are on the originating and terminating layers of the PCB, while anti-pads on all intermediate layers allow the copper pipe to be electrically isolated from the circuits on these layers as they pass through.

　　Although the two external pads and anti-pads are part of the layout pattern that is etched onto the PCB, the electrodeposition process forms a copper tube that connects the two. While in conventional PCB multilayer circuit boards, vias may be found, these are less likely in high density interconnect or HDI circuit boards.

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