source:Industry News release time:2022-05-12 Article author:yu Popular:pcb
HDI: Abbreviation for high Density interconnection, high-density interconnection, non-mechanical drilling, micro-blind hole hole ring below 6mil, wiring line width/line gap between inner and outer layers below 4mil, and pad diameter not greater than 0.35mm. The laminate production method is called HDI board.
Blind via: short for Blind via, which realizes the connection between the inner layer and the outer layer
Buried via: short for Buried via, which realizes the connection between the inner layer and the inner layer.
In general, 8-bit MCU products use 2-layer through-hole boards; 32-bit MCU-level intelligent hardware uses 4-6-layer through-hole boards; Linux and Android-level intelligent hardware use 6-layer through-hole to 8-layer through-hole boards. tier HDI circuit board;
The number of through-hole boards has nothing to do with the number of layers. Usually, the 2-layer boards used by everyone are through-hole boards, while many switches and military circuit boards have 20 layers, which are still through-holes.
Use a drill to drill through the board and then copper-plate the holes to create vias.
It should be noted here that the inner diameter of the through hole is usually 0.2mm, 0.25mm and 0.3mm, but generally 0.2mm is much more expensive than 0.3mm. Because the drill bit is too thin and easy to break, the drill is also slower.
The extra time and the cost of the drill bits are reflected in the rise in the price of the circuit board.
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