source:Industry News release time:2022-10-19 Article author:yu Popular:pcb
1、 Contact the manufacturer
First, the manufacturer shall be informed of the documents, process requirements and quantities.
2、 Material opening
Purpose: According to the requirements of the engineering data MI, cut the large plates that meet the requirements into small pieces for production. Small plates that meet customer requirements
Process: large plate → plate cutting according to MI requirements → curium plate → beer fillet edge grinding → plate out
3、 Drilling
Purpose: According to the engineering data, drill the required hole diameter at the corresponding position on the sheet metal with the required size
Process: laminated pin → upper plate → drilling → lower plate → inspection/repair
4、 Copperplate
Purpose: Copper deposition is to deposit a thin layer of copper on the wall of insulating hole by chemical method
Process: rough grinding → hanging plate → copper automatic line → lower plate → dipping 1% dilute H2SO4 → thickening copper
5、 Graphic transfer
Purpose: Graphic transfer is to transfer the image on the production film to the board
Process: (blue oil process): plate grinding → printing the first side → drying → printing the second side → drying → lighting → developing → inspection; (Dry film process): hemp board → pressing film → standing → alignment → exposure → standing → developing → inspection
6、 Graphic electroplating
Purpose: Pattern electroplating refers to electroplating a copper layer with the required thickness and a gold nickel or tin layer with the required thickness on the exposed copper skin or hole wall of the circuit pattern
Process: upper plate → degreasing → secondary water washing → micro etching → water washing → pickling → copper plating → water washing → pickling → tin plating → water washing → lower plate
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