source:Industry News release time:2022-06-28 Article author:yu Popular:pcb
Power integrity problems are mainly caused by unreasonable design of decoupling capacitors, serious loop effects, poor segmentation of multiple power/ground planes, unreasonable ground layer design, and uneven current flow. Through power integrity simulation, find these problems, and then solve the power integrity problem by:
(1) By adjusting the PCB laminate line width and the thickness of the dielectric layer to meet the requirements of the characteristic impedance, adjusting the laminate structure to meet the principle of short return path of the signal line, adjusting the power/ground plane division, avoiding the cross division of important signal lines The phenomenon;
(2) The power supply impedance analysis of the power supply used on the printed board was carried out, and the capacitor was added to control it under the target impedance;
(3) By adjusting the position of the device in the part with high current density, the current can pass through a wider path.
In power integrity analysis, the main simulation types are DC drop analysis, decoupling analysis, and noise analysis. DC drop analysis includes analysis of complex traces and planar shapes on the PCB, which can be used to determine how much voltage will be lost due to copper resistance.
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