PCB briefly describes the design and development process.Aluminum electrolytic capacitor PCB_

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PCB briefly describes the design and development process.Aluminum electrolytic capacitor PCB

source:Industry News release time:2022-04-15 Article author:yu Popular:pcb

　　 PCB briefly describes the design and development process.Aluminum electrolytic capacitor PCB(图1)

　　1. Make a schematic diagram according to the design

　　2. After the schematic diagram is compiled and passed, the corresponding network table can be generated

　　3. Make a physical border (Keepout Layer)

　　4. Introduction of components and networks

　　5. Layout of components

　　The layout and wiring of components have a great impact on product life, stability, and electromagnetic compatibility, and should be paid special attention to. Generally speaking, there should be the following principles: (1) Place the components in the fixed position related to the structure first, such as power sockets, indicator lights, switches, connectors, etc. After these components are placed, use the LOCK function of the software to remove them. Lock it so that it cannot be moved by mistake in the future. Then place special components and large components on the line, such as heating elements, transformers, ICs, etc. Place the widgets last. (2) Pay attention to heat dissipation The layout of components should also pay special attention to heat dissipation. For high-power circuits, those heating elements such as power tubes, transformers, etc. should be placed as far as possible in a distributed layout to facilitate heat dissipation, not concentrated in one place, and high capacitance should not be too close to prevent premature aging of the electrolyte.

　　6. Wiring

　　7. Adjust and improve

　　After completing the wiring, all you need to do is to make some adjustments to the text, individual components, and traces and apply copper (this work should not be done too early, otherwise it will affect the speed and bring trouble to the wiring), also for the convenience of production, Commissioning and maintenance. Copper plating usually refers to filling the blank area left after wiring with a large area of copper foil. You can lay GND copper foil or VCC copper foil (but this will easily burn the device in the event of a short circuit, and it is best to ground it unless you have to use it as a last resort). To increase the conduction area of the power supply, it can only be connected to VCC in order to withstand a larger current). Ground wrapping usually refers to wrapping a bunch of signal lines with special requirements with two ground wires (TRAC) to prevent it from being disturbed or disturbed by others. If you use copper instead of ground wire, you must pay attention to whether the whole ground is connected, the current size, flow direction and whether there are special requirements to ensure that unnecessary mistakes are reduced.

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