source:Industry News release time:2022-04-08 Article author:sznbone Popular:pcb
The original name of the circuit board comes from the English PCB (Printed Circuit Board), the Chinese translation is called "printed circuit board", and some people call it PWB (Printed Wiring Board). . He replaced the copper wire distribution method of electrical products before the 1940s, which accelerated the speed of mass production and replication, reduced product size, improved convenience, and lowered unit prices.
The latest circuit board is to melt the metal and cover the surface of the insulating board to make the desired circuit. After 1936, the production method turned to select the area of the insulating substrate covered with corrosion-resistant ink, and remove the unnecessary area by etching. This method is called (Subtractive Method).
After 1960, the market of record players, tape recorders, video recorders and other products has successively adopted the circuit board manufacturing technology of double-sided through-holes, so the epoxy resin substrate with heat resistance and stable size has been widely used, and it is still the main resin for circuit board production. substrate.
PCB circuit board (impedance circuit board)
With the evolution of semiconductor technology, electronic products are moving towards higher density structures. Electronic assembly is a one-to-one combination structure. When the density of electronic components increases, of course, the carrier circuit board of the components also needs to increase the connection density, which gradually forms the design trend of today's high-density circuit boards.
Although the concept of build-up circuit boards has gradually appeared in products since 1967, it was not until IBM released SLC technology in 1990 that microvia technology gradually matured and became practical. Before that, if the full-board through holes of the circuit board were not used, the designer would use multiple pressing methods to obtain a higher wiring density. Technology has gradually become the main design structure of high-density circuit boards and appears in many mobile electronic products.
In the connection between circuit layers, in addition to electroplating, the use of conductive paste technology for connectors has also appeared one after another. The more well-known ones are: ALIVH method published by Panasonic Corporation and B2it method published by Toshiba Corporation. These technologies are applied to circuit boards. Pushed into the era of high density (High Density Interconnection-HDI). The development time course of the main build-up board technologies is shown in Table 1.1.
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