source:Industry News release time:2022-11-28 Article author:yu Popular:pcb
Current circuit boards are mainly composed of
Line and pattern: The line is used as a tool for conducting between the original parts. In the design, a large copper surface will be additionally designed as the grounding and power supply layer. Lines and drawings are made at the same time.
Dielectric layer: It is used to maintain the insulation between lines and layers, commonly known as substrate.
Hole (Through hole/via): Through hole can make more than two layers of lines conductive to each other. The larger through hole is used as part plug-in. In addition, non through hole (nPTH) is usually used for surface mounting and positioning, and is used to fix screws during assembly.
Solder resistant/Solder Mask: Not all copper surfaces need tin coated parts. Therefore, non tin coated areas will be printed with a layer of substance (usually epoxy resin) to isolate tin on copper surfaces, so as to avoid short circuit between non tin coated lines. According to different processes, it can be divided into green oil, red oil and blue oil.
Legend/Marking/Silk screen: This is an unnecessary composition. Its main function is to mark the name and position box of each part on the circuit board for maintenance and identification after assembly.
Surface Finish: Since the copper surface is easy to oxidize in general environment, which leads to tin coating failure (poor solderability), it will be protected on the copper surface that needs tin. The protection methods include HASL, ENIG, Immersion Silver, Immersion Tin, and OSP. Each method has its advantages and disadvantages, which are collectively referred to as surface treatment.
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