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PCB future trends.Aluminum electrolytic capacitor PCB

source:Industry News release time:2022-05-20 Article author:yu Popular:pcb

  PCB future trends.Aluminum electrolytic capacitor PCB(图1)

  1. The R&D cycle is continuously shortened

  The replacement of electronic products has intensified, and new functions have emerged one after another, shortening the service life of consumer electronic products. The shortening of the market opportunity window has forced product development to accelerate, and the PCB development cycle has been compressed accordingly.

  Solutions for PCB engineers:

  To use first-class EDA tool software.

  In pursuit of one-board success, PCB professional engineers comprehensively consider various factors and strive for one-time success.

  Multiple people design in parallel, division of labor and cooperation.

  Module reuse, emphasis on technology precipitation.

  In addition, it is also very important and necessary for PCB engineers to intervene in the product development process in advance to reduce subsequent rework.

  2. Continuous improvement of signal rate

  With the continuous improvement of signal rate, signal integrity continues to plague R&D personnel, including bus drive capability, signal reflection, crosstalk, timing, etc.

  Solutions for PCB engineers: professional SI engineers participate, and PCB design engineers master certain high-speed PCB design skills.

  3. Increase the density of the veneer

  From breadboards to single-sided boards, to double-sided boards, multi-layer boards, and HDI boards, the miniaturization of electronic products has intensified the high density and refinement of PCB design. 50-75μm fine wires have gradually become the mainstream and are widely used in smart terminal equipment.

  Solutions for PCB engineers: PCB engineers must keep up with the forefront of the industry and understand new materials and new processes, such as buried resistance, buried capacitance technology, HDI technology, etc. Adopt first-class EDA software that can support high-density PCB design. Package substrate technology will be gradually introduced into conventional PCB design.

  4. The working voltage of the gate circuit is getting lower and lower

  With the development of electronic technology, the working voltage of the circuit is getting lower and lower, and the current is getting bigger and bigger. Although low-voltage operation is beneficial to reduce the overall power consumption of the circuit, it also brings new challenges to the power supply design of the PCB.

  Solutions for PCB engineers: To clarify the power supply channel, not only to meet the needs of the current carrying capacity, but also to appropriately increase the decoupling capacitor, if necessary, use the adjacent and tightly coupled power supply ground plane to reduce the power supply ground plane impedance. Reduce power supply ground noise. In addition, the buried capacitance technology can effectively reduce the ground plane impedance of the power supply, and is gradually gaining favor in high-density terminal electronic equipment. In order to deal with the power supply ground noise problem in the low voltage era, a full-time PI engineer becomes necessary


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