source:Industry News release time:2021-12-03 Article author:sznbone Popular:pcb
1. The full name of BT resin is the "Double Authority Sanxian Resin" developed by Japan Mitsubishi Gas Company. Although the patent period of BT resin has expired, Mitsubishi Gas Company will still be at the peak of the world in the development and application of BT resin. BT High Tg, High heat resistance, humidity resistance, low dielectric constant (Dk), low dielectric constant (Df) and other advantages. Due to the existence of the glass fiber layer, although the wiring is thicker and harder than the FC base made by ABF, the perforation is higher and meets the requirements of fine lines, but it can stabilize the size and prevent thermal expansion and contraction from affecting the line yield. BT is mainly used Material. Chips and logic chips.
2. It is a material led by Intel and used to produce high-end carriers such as flip-chip chips. , GPU, chipset and other large high-end chips. ABF is a build-up layer, which can be connected to the circuit by directly pressing the ABF onto the copper material, and does not require thermal processes.
3. MIS chip packaging technology is a new type of technology that is developing rapidly in the analog, power IC, and digital currency markets. Copper components to provide electrical connections during the packaging process.
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