Poor tin on pcb board.BGA circuit board factory_

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Poor tin on pcb board.BGA circuit board factory

source:Industry News release time:2022-07-26 Article author:yu Popular:pcb

　　 Poor tin on pcb board.BGA circuit board factory(图1)

　　The poor tinning of the PCB board is generally related to the cleanliness of the surface of the PCB empty board. If there is no pollution, there will be basically no poor tinning. The second is the poor flux, temperature, etc. when tinning. Then the common electrical tin defects of printed circuit boards are mainly reflected in the following points:

　　1. There are particulate impurities in the plating layer of the pcb board, or there are polishing particles left on the surface of the circuit during the manufacturing process of the substrate.

　　2. The tin surface of the substrate or parts is oxidized and the copper surface is dark.

　　3. There are flakes on the pcb board that cannot be tinned, and there are particulate impurities in the plating on the board surface.

　　4. There are grease, impurities and other debris on the pcb board surface, or there is residual silicone oil.

　　5. The high-potential coating is rough, and there is a phenomenon of burning board. There are sheets on the PCB surface that cannot be tinned.

　　6. The coating on one side is complete, the coating on the other side is poor, and the low-potential hole has obvious bright edge phenomenon.

　　7. The edge of the low-potential hole has obvious bright edge phenomenon, the high-potential coating is rough, and there is a phenomenon of burning board.

　　8. Sufficient temperature or time is not guaranteed during the soldering process, or the flux is not used correctly.

　　9. The low-potential large area cannot be plated with tin, the surface of the board is slightly dark red or red, one side of the coating is complete, and the other side is poorly coated.

　　The reasons for poor tinning of pcb circuit boards are mainly reflected in the following points:

　　1. Too few anodes and uneven distribution.

　　2. Tin light agent is out of balance in small or excessive amounts.

　　3. There is some residual film or organic matter before plating.

　　4. The current density is too large and the plating solution is not filtered enough.

　　5. The composition of the bath potion is out of balance, the current density is too small, and the electroplating time is too short.

　　6. The anode is too long, the current density is too large, the local wire density of the pattern is too thin, and the light agent is out of balance.

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